AMD is reportedly preparing its next-gen Ryzen AI PRO 300 "Strix" launch for October with two variants, the Ryzen 370 & Ryzen 360.
AMD's Ryzen AI PRO 300 "Strix" Series APUs Will Launch In Q4 This Year, Includes Ryzen 7 SKUs As Well
This isn't the first time we have seen the Ryzen AI PRO 300 models within the Strix Point lineup surface up since we spotted some SKUs in shipping manifests, which not only revealed the existence of the PRO series but also models such as the Ryzen 9 PRO AI HX and Ryzen 7 PRO AI as well.
However, details at that time were limited; hence, it created uncertainty surrounding the upcoming Ryzen PRO series, but not anymore. The leaker Hoang Anh Phu has shared details about the "Ryzen AI 300" PRO series, claiming that AMD plans to launch the lineup by October.
AI 9 HX PRO 370
AI 7 PRO 3606 months after PRO 8000 released
— Hoang Anh Phu (@AnhPhuH) July 4, 2024
While the leaker specifically didn't mention the date, Hoang disclosed that AMD plans to launch the series six months after the Ryzen PRO 8000 series launch, which already happened two months ago in April. This means that we can expect the Ryzen AI 300 PRO SKUs to be released by October. Fortunately, the leaker also disclosed details about certain models as well, and it looks like the newer PRO series SKUs will feature models such as the Ryzen AI 9 HX PRO 370 and the Ryzen AI 7 PRO 360.
This not only validates the details we saw with the shipping manifest leak, but it also tells us that the Ryzen 7 models are indeed present in the Ryzen AI PRO 300 "Strix Point" lineup, with their first appearance in the upcoming PRO series. We are currently unaware of the specifications, but it was disclosed previously that the Ryzen 7 PRO model will feature a 12-core count. This might not be true, considering that a 10-core count is more "believable" here, as the top-tier Ryzen AI 300 SKU comes with a 12-core count.
It's interesting to see the Ryzen AI 300 "PRO" SKUs pop up only two months after the launch of the Ryzen 8000 PRO APUs. Team Red may find the PRO lineup with more potential when it debuts with the Strix Point series, or it may be an opportunity to grasp the growing AI PC market.
AMD Ryzen AI 300 "Strix/Krackan" APUs:
| CPU Name | Cores / Threads | Core Config | Clock Speeds (Max) | Cache (Total) | AI Capabilities | iGPU | TDP |
|---|---|---|---|---|---|---|---|
| Ryzen AI 9 HX 375 | 12/24 | 4x Zen 5 / 8x Zen 5C | 2.0 / 5.1 GHz | 36 MB / 24 MB L3 | 85 AI TOPs (55 TOPS NPU) | Radeon 890M (16 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 9 HX 370 | 12/24 | 4x Zen 5 / 8x Zen 5C | 2.0 / 5.1 GHz | 36 MB / 24 MB L3 | 80 AI TOPs (50 TOPS NPU) | Radeon 890M (16 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 9 HX PRO 370 | 12/24 | 4x Zen 5 / 8x Zen 5C | 2.0 / 5.1 GHz | 36 MB / 24 MB L3 | 80 AI TOPs (50 TOPS NPU) | Radeon 890M (16 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 7 365 | 10/20 | 4x Zen 5 / 6x Zen 5C | 2.0 / 5.0 GHz | 30 MB / 20 MB L3 | 80 AI TOPs (50 TOPS NPU) | Radeon 880M (12 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 7 PRO 360 | 8/16 | 3x Zen 5 / 5x Zen 5C | 2.0 / 5.0 GHz | 24 MB / 16 MB L3 | 72 AI TOPs (50 TOPS NPU) | Radeon 880M (12 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 7 350 | 8/16 | 4x Zen 5 / 4x Zen 5C | 2.0 / 5.0 GHz | 24 MB / 16 MB L3 | 66 AI TOPs (50 TOPS NPU) | Radeon 860M (8 CU @ 3.0 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 5 340 | 6/12 | 3x Zen 5 / 3x Zen 5C | 2.0 / 4.8 GHz | 22 MB / 16 MB L3 | 59 AI TOPs (50 TOPS NPU) | Radeon 840M (4 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 5 330 | 4/8 | 1x Zen 5 / 3x Zen 5C | 2.0 / 4.5 GHz | 12 MB / 8 MB L3 | 50 TOPS (NPU) | Radeon 820M (2 CU @ 2.8 GHz) | 28W (cTDP 15-54W) |
News Sources: @AnhPhuH , Videocardz
About the author: Muhammad Zuhair is a hardware and technology reporter for Wccftech, specializing in the semiconductor industry and the complex interplay between technology, manufacturing, and geopolitics. His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e.g., 2nm process), the economic impact of policies like the CHIPS Act, and the strategic development of AI infrastructure from NVIDIA, AMD and Intel.
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