All AMD Ryzen 3000 CPUs Will Feature Soldered IHS, Expect Impressive Thermals & Great Overclocking Capability
AMD has confirmed that all of their upcoming 3rd Gen Ryzen 3000 series processors featuring the Zen 2 core architecture will feature a soldered design. Since the launch of their 1st generation, the Ryzen series has been utilizing a soldered design which helps deliver better thermal results when compared to traditional TIM application.
AMD Ryzen 3000 Series CPUs To Utilize Soldered IHS With Gold Plating To Deliver Better Thermals & Overclocking Results
AMD has so far used solder on all of their Ryzen CPUs, Ryzen Theadripper CPUs and the upcoming Ryzen ‘Picasso’ APUs are also confirmed to feature Soldered IHS. Continuing the tradition, AMD will also feature solder IHS on their upcoming Ryzen 3000 series processors which are based on the Zen 2 core and supported by the X570 platform. This was confirmed by AMD’s Senior Technical Marketing Manager, Robert Hallock:
Soldered like a boss.
— Robert Hallock? (@Thracks) May 28, 2019
AMD is known to utilize a very high-quality solder design on their processors which includes gold plating and silicone protected capacitors which offer better durability and proper contact with the integrated heat spreader to dissipate heat more effectively to the cooling solution. AMD’s rivals at Intel had until recently been using high-quality TIM (Thermal Interface Material) which wasn’t up to the same quality as solder but the recent 9th Generation Unlocked K-series processors did include soldered IHS and gold plating which resulted in better thermal results.
Since soldered designs help scrape off a few degrees from the thermal load, that extra headroom can be used for overclocking the chip which in the case of Ryzen 3000 is looking to be stellar given the reports we have seen so far. Also, the solder would be interesting since AMD has three chips on each of their Ryzen 3000 CPUs, two Zen 2 dies and an I/O die. The Zen 2 CCX is configured with 4 cores and there’s 2 CCX per Zen 2 die. So the 8 core parts can be configured with a single Zen 2 die while the 8+ cores will be configured with two Zen 2 dies. AMD has experience with soldering a chip with various dies before as their Ryzen Threadripper series which also makes use of solder has a total of 4 Zen/Zen+ chiplets on the interposer.
Why Do Overclockers Delid Their CPUs?
Delidding became hugely popularity after Intel introduced its Haswell family of Core i7 and Core i5 CPUs which infamously ran very hot. In an effort by overclockers to identify why these chips ran as hot as they did and to try and improve their thermal performance many proceeded to delid their chips. This revealed the culprit behind the unusually high temperatures of Haswell which was that Intel had forgone soldering the IHS onto the die and resorted to using a thermal compound instead as a cost-cutting measure.
While Intel has followed into AMD’s footsteps, people still try to delid their processor and use high-quality liquid metal thermal pastes which delivers up to 20 degrees lower temperature compared to the standard TIM applications. However, one of the downsides of the soldered design is that it will become really hard to delid the chip as there’s always the risk of breaking the die itself which already happened when one leaker tried to delid the Ryzen 3 3200G APU. However, I feel that there is no real need for delidding an already soldered part since you’re already benefiting from a much better design than standard TIM.
AMD Ryzen 3000 Series CPU Lineup
|CPU Name||Ryzen 5 3600||Ryzen 5 3600X||Ryzen 7 3700X||Ryzen 7 3800X||Ryzen 9 3900X||Ryzen 9 3950X|
|Base Clock||3.6 GHz||3.8 GHz||3.6 GHz||3.9 GHz||3.8 GHz||3.5 GHz|
|Boost Clock||4.2 GHz||4.4 GHz||4.4 GHz||4.5 GHz||4.6 GHz||4.7 GHz|
|Cache (L2+L3)||35 MB||35 MB||36 MB||36 MB||70 MB||72 MB|
|PCIe Lanes (Gen 4 CPU+PCH)||40||40||40||40||40||40|
|Price||$199 US||$249 US||$329 US||$399 US||$499 US||$749 US|
The Next-Gen X570 Chipset – First Mainstream Platform To Support PCIe Gen 4, Feature Rich and Ready For Ryzen 3000 CPUs
As we saw with X470, there were a few features for the Ryzen 2000 series processors which were only supported by new motherboards such as Precision Boost Overdrive and XFR 2.0. There’s no doubt that AMD’s Zen 2 based Ryzen mainstream processor family has some amazing new features but the main highlight would be support for PCIe Gen4. The X570 platform will be an all PCIe Gen4 solution, which means this would most probably be the first consumer platform to feature support for the new PCIe standard.
In terms of IO details, the CPU will once again be offering a total of 24 PCIe Gen 4 lanes while the PCH will be providing a total of 16 PCIe Gen 4 lanes. There would be one direct link heading out to the first PCI Express x16 and PCI Express x4 slot from the CPU while the rest of the IO would be handled by the X570 PCH which would be linked to the CPU through an x4 link.
That, however, doesn’t mean that AMD Ryzen 3000 series would only be compatible on X570 boards since just like last time, the new CPUs will be backward compatible with X470 & X370 boards too. Following are links to the respective motherboard manufacturers BIOS release for existing motherboards to support 3rd Gen AMD Ryzen CPUs:
- ASRock AM4 (3rd Gen Ryzen) BIOS Support Link
- Gigabyte AM4 (3rd Gen Ryzen) BIOS Support Link
- ASUS AM4 (3rd Gen Ryzen) BIOS Support Link
- MSI AM4 (3rd Gen Ryzen) BIOS Support Link
- BIOSTAR AM4 (3rd Gen Ryzen) BIOS Support Link
They certainly won’t display the same feature set that will be available on the newly launched X570 lineup but will feature fully stable functionality for users who just want to drop in a new CPU and continue using their PCs without the hassle of upgrading the motherboard and everything from scratch. AMD’s X570 platform and Ryzen 3000 CPUs are planned for launch on 7th of July so expect more performance numbers and details to be available before that, especially on the E3 Horizon event which is a few weeks from now.