Intel Progresses on the 14nm Node with Altera – 10th Generation SoC with Hybrid Memory Cubes (HMC)
Altera is one of the largest (if not the largest) FPGA and SoC maker out there right now. Their partnership with Intel has a good history and their build quality is usually remarkable. Interestingly, Altera’s FPGA are always about one generation ahead of desktop processors as Intel Fab’s give priority to silicon request from Altera. Intel has just deepened their relationship further with Altera’s 10th Generation FPGA based on the 14nm Tri Gate node with HMCs.
Altera 10th Generation Stratix FPGA and Socs with 14nm FinFET and HMC
Now the new relationship will usher in a new range of products will be a “System in a Package” form factor. Which basically means an SoC with a board. But interestingly these boards feature an HMC or a Hybrid Memory Cube which is one of the next-big-things in the Memory Industry. Altera’s work with Intel will enable the development of multi-die devices that efficiently integrates monolithic 14 nm Stratix 10 FPGAs and SoCs with other advanced components, which may include DRAM, SRAM, ASICs, processors and analog components, in a single package. The integration will be enabled through the use of high-performance heterogeneous multi-die interconnect technology. . The devices will address the performance, memory bandwidth and thermal challenges impacting high-end applications in the communications, high-performance computing, broadcast and military segments.
An interesting point to note is that the result will be the fastest system one can achieve using current 2D and 3D tech.
— Usman Pirzada (@usmanpirzada) March 29, 2014