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Semiconductor
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Apple Was TSMC’s Biggest Customer In 2024, Accounting For 24% Of Revenue, But It Might Lose That Position Due To Increased HPC Orders In 2025
TSMC Taking First Steps To Build Its 1.4nm Facility In Taiwan By End Of 2025, Will Not Adopt ASML’s High-NA EUV Machines For This Process
M5 To Reportedly Be Announced This Week, But New Update Says The Chipset Will Be Fabricated On TSMC’s 3nm ‘N3E’ Process, Not N3P
TSMC’s 2nm Capacity Completely Sold Out At Two Local Plants For 2026, Production Output Target At 100,000 Monthly Wafers By Next Year
Dimensity 9500 Is Estimated To Be More Than 50% Cheaper Than The Snapdragon 8 Elite Gen 5, Despite Using The Same 3nm N3P Process
Snapdragon 8 Elite Gen 5 Price Per Unit Estimate Will Definitely Make You Question Your Upcoming Android Flagship Purchase
Apple, Qualcomm, & MediaTek To Unveil Their First 2nm N2 Chipsets In 2026, New Rumor Downplays Any ‘N2P’ Releases For Next Year
TSMC’s 2nm Customers Can Take A Breather; Wafers Reportedly Only 10-20 Percent More Expensive Than 3nm But There Is A Catch
Samsung Continues To Pursue Snapdragon 8 Elite Gen 5 Orders Under Its 2nm GAA Process; Chipsets Said To Be In Trial Production
Apple M5 vs M4 Specifications Comparison – Here Is What We Know So Far
Samsung Has Reportedly Kicked Off Mass Production Of Its Exynos 2600 On Its 2nm GAA Process, With Yields Jumping To 50 Percent
Qualcomm Rumored To Use TSMC’s 2nm ‘N2P’ Process For Two Generations, Starting With The Snapdragon 8 Elite Gen 6 Next Year
Snapdragon X2 Elite Extreme Die Package Shows SiP Memory Arrangement Similar To Apple’s Unified RAM Architecture, Ensuring High Bandwidth
Snapdragon 8 Elite Gen 5 Is Now The Fastest Mobile CPU In Multi-Core Workloads, But Consumes 61% More Power Than A19 Pro To Achieve This
The Snapdragon X2 Elite Family Has Two Versions That Use The 3nm Process, Boost Up To 5.00GHz And Equipped With Up To 18 Cores
Snapdragon 8 Elite Gen 5 Announced With 3rd-Gen Oryon Cores Running Up To 4.60GHz, Being Called The Fastest Mobile CPU In The World
Dimensity 9500 Has Higher FP32 Compute Power Than An Xbox Series S Console, Thanks To The Massive ARM Mali-G1 Ultra Upgrade
A19 Pro’s Surprising Star Performer Are Its Four Efficiency Cores, Delivering Up To A 29 Percent Improvement At No Additional Power Draw
MediaTek Wants You To Believe The Dimensity 9500 Can Compete With A19 Pro In Single & Multi-Core Benchmarks; Here Is The Reality
Dimensity 9500 Goes Official Sporting An All-Performance Cores Architecture With ARM’s C1, Matches A19 Pro In Single & Multi-Core Scores
Qualcomm, MediaTek Have Reportedly Paid TSMC Up To 24 Percent More For The Snapdragon 8 Elite Gen 5 & Dimensity 9500 Due To Increased Wafer Prices
Exynos 2600 Could Become Samsung’s First 2nm GAA Chipset And Found In The Galaxy S26 Series – Here Is Everything You Need To Know
Apple Has Reportedly Secured More Than Half Of TSMC’s Entire 2nm Capacity To Starve Its Rivals, Including Booking An Entire Plant
Apple Preparing Four New 2nm Chipsets In 2026, With At Least Two Of Them Adopting An Advanced Packaging Technology
A19 Pro, A19 Comprehensive Differences Show Major Contrast In SLC Cache, GPU Specs, Memory Frequency, Bandwidth And More
Samsung Reportedly Beginning Exynos 2600 Mass Production By The End Of September On Its Cutting-Edge 2nm GAA Process
Apple’s In-House N1 Wireless Chip Does Not Support The 320MHz Channel; Here Is What That Means For The iPhone 17’s Wi-Fi 7 Speeds
Broadcom CEO Stands Alongside Steve Jobs In Memorability, Says Analyst As He Hikes Target Price To $415
Samsung Installed First High-NA EUV Machine For 1.4nm Production In March, Could Pay Zero Tariffs To Better Compete With TSMC
JPMorgan’s Big NVIDIA Update: All 6 Next-Gen Vera Rubin AI Chips Enter Final Pre-Production Stages At TSMC Amidst Extremely High AI Demand!
BofA Finds AMD Has Become The Least Owned Semiconductor Stock In The S&P 500, With Just A 20 Percent Exposure Among Fund Managers
Samsung Bringing More ASML-Made High-NA EUV Machinery To Its Local Manufacturing To Speed Up 2nm GAA Wafer Production
Applied Materials (AMAT) Asserts US Incentives To Expand Domestic Chipmaking Capacity Only “Matter A Little Bit At The Margin”
Goldman Sachs Forced To Chase After China’s NVIDIA Cambricon As It Glows Red Hot
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