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Page 29 of 56
All posts related to the industry in general.
TSMC To Mass-Produce Huge Chips Using “CoW-SoW” Packaging Technology By 2027
Microsoft and Apple In Disagreement About Cloud Gaming Again
NVIDIA Blackwell GB200 AI Servers To Ship Out In Q4 2024, Putting An End To Delay Rumors
China’s In-House Chips Are Said To Be Just Three Years Behind TSMC, US Curbs Show Little Impact
Intel Looks For Options To Escape The Dire Financial Situation, Foundry Business Likely To Take A Massive Hit
Samsung Foundry’s Revenue Was Higher Than TSMC & Intel In Q2 As A Result of DRAM & NAND Price Hikes
Spiders Management Respond to Allegations Made By STJV
Members of Spiders Go On Strike Due To Issues Within The Company
TSMC’s 3nm & 5nm Processes Expected To Generate Over $31 Billion For The Firm In Just Three Quarters
Imagination Technologies Recieves $100 Million To “Rise From The Ashes” & Leverage The Edge AI Hype
LG Solves The OLED Brightness & Efficiency Issue Through Two-Stack Tandem Structure
AMD To Establish Two R&D Facilities In Taiwan, Total Cost Reaching Up To $270 Million
SK hynix Proposes Development of Next-Gen HBM Memory Standard With 30x Performance Uplift Versus Current Gen
Samsung’s Next-Gen HBM4 Memory To Enter Mass Production By End-2025, Tape-Out To Be Achieved Next Quarter
Almost 90% of Developers Surveyed Says Premium Games Don’t Need Microtransactions
ASML’s CEO Believes That Europe Needs China’s Legacy Chips To Sustain Demand But 10 Years Behind In Chip Tech
Samsung To Acquire Its First High-NA EUV Lithography Machinery By Next Quarter, Commercial Implementation Expected In Late 2025
NVIDIA’s Blackwell AI Accelerators To Witness Limited Shipments From Foxconn In Late 2024
SK Hynix Preps Large-Scale DRAM Price Hike, DDR5 Up To 20% Expensive
Huawei Preps Ascend 910C To Tackle NVIDIA’s H100 In China’s Domestic AI Market
NVIDIA Blackwell AI Servers Exposed To “Component Shortage”, Limited Supply Expected In Q4 2024
Intel Scales Up Outsourcing Efforts, 3nm Handed Over To TSMC & Adds In New Suppliers For Advanced Packaging
NVIDIA Readies “Scaled-Down” Blackwell B200A AI Accelerator, Targeting The Wider Enterprise & AI Market
Samsung’s 8-Layer HBM3E Passes Quality Checks For NVIDIA’s AI Chips
TSMC To Raise 3nm & 5nm Prices By Up To 8%, CoWoS To Witness Price Increase Too
Nintendo Q1 2025 Report Reveals Sales Down By 46.5%
SK Hynix Preparing NAND With ‘400-Layers’ Through Hybrid Bonding, 321-Layer NAND Shipping In 1H 2025
Microsoft and Activision Form New Team In Blizzard
DRAM Prices Will Increase Up To 53% In 2024 & Another 35% in 2025 As Memory Industry Delivers Record Revenue Growth
Electronic Arts SEO in Talks with SAG-AFTRA to Reach Deal
Samsung HBM3E Memory Headed To NVIDIA’s AI GPUs Within 2-4 Months
TSMC To Initiate Construction of First European Fab In Germany Next Month, Production Expected By 2027
Capcom Games Sales Down By 44% During Q1 FY25
Intel Reportedly Lures TSMC’s “Top-Level” Arizona Employees, Fueling Up Competition
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