Industry Page 26 of 56

All posts related to the industry in general.

NVIDIA Is Still Working Upon Securing AI "HBM" Memory Supply From Samsung, Despite Recent Setbacks 1

NVIDIA Is Still Working Upon Securing AI “HBM” Memory Supply From Samsung, Despite Recent Setbacks

AI Servers Can Reach "Rack Density" Of 1000+ KW Likely With NVIDIA's Next-Gen "Rubin Ultra" Architecture 1

AI Servers Can Reach “Rack Density” Of 1000+ KW Likely With NVIDIA’s Next-Gen “Rubin Ultra” Architecture

Qualcomm's 3rd Gen Oryon CPU Cores Coming To Snapdragon X "AI PC" Platforms In 2025, 2nd Gen Targetting Mobile Segments 1

Qualcomm’s 3rd Gen Oryon CPU Cores Coming To Snapdragon X “AI PC” Platforms In 2025, 2nd Gen Targeting Mobile Segments

Microsoft Unveils NVIDIA's "Blackwell-Based" High-End Azure AI Compute Platform; HPC-Focused Azure AMD EPYC With HBM As Well 1

Microsoft Unveils NVIDIA’s “Blackwell-Based” High-End Azure AI Compute Platform; HPC-Focused Azure AMD EPYC With HBM As Well

TSMC 2nm Process Is Right On-Track, Slated For Mass-Production By 2025 & Sees “All-Time” High Demand

NVIDIA AI server

NVIDIA’s First Blackwell GB200 NVL72 Server Racks Shipped Amidst Reports of Thermal Issues

TensorWave Plans To Build World’s Largest AMD GPU Clusters By 2025, Utilizing Instinct MI300X, MI325X, MI350X AI GPUs & Gigawatt Capacity

ASML Believes Global Semiconductor Markets Will Reach $1 Trillion Valuation By 2023, Driven By Huge AI Demand 1

ASML Believes Global Semiconductor Markets Will Reach $1 Trillion Valuation By 2030, Driven By Huge AI Demand

TSMC's Arizona Facility Opening Is Reportedly Delayed To January 2025, As The Taiwan Giant Prepares For The "Trump Era" 1

TSMC’s Arizona Facility Opening Is Reportedly Delayed To January 2025, As The Taiwan Giant Prepares For The “Trump Era”

Samsung HBM4 Memory In Development For 2025 Debut: 16-Hi Stacks & 3D Packaging 1

Samsung To Develop “Custom HBM4” Solutions For Meta & Microsoft, Signaling A Massive Breakthrough

LG Electronics & Tenstorrent Expands "AI Chip" Partnership, Now Targeting To Provide Efficient AI Solutions 1

LG Electronics & Tenstorrent Expands “AI Chip” Partnership, Now Targeting To Provide Efficient AI Solutions

SoftBank To Build Japan's Largest AI Supercomputer With NVIDIA's Blackwell AI Chips 1

SoftBank To Build Japan’s Largest AI Supercomputer With NVIDIA’s Blackwell AI Chips

TSMC Reportedly Reaches "100% Utilization" With 5nm & 3nm Supply, Showing Its Dominance Over The Markets 1

TSMC Reportedly Reaches “100% Utilization” With 5nm & 3nm Supply, Showing Its Dominance Over The Markets

Intel CEO Hopes To Make Chips For AMD As Chipzilla Kickstarts Its Custom Chip Business With Intel Foundry 1

Intel To Reportedly Outsource More “Arrow Lake” Orders To TSMC; Team Blue No Longer Confident In Its Foundry Business

AMD EPYC CPUs Are Helping TSMC Manufacturer Next-Generation Chips Faster

TSMC “Forbidden” To Manufacture 2nm Chips Outside Taiwan; Raising Questions On The Future of TSMC-US Ambitions

TSMC Receives Additional $11 Billion Funding Under The CHIPS Act, New 2nm Fab In Development 1

Biden & Trump Are Rumored To Attend TSMC’s Arizona Facility Opening In December; Past & Future of US Semiconductors In One Place

Samsung Releases New Technology To Compete With TSMC Chip Orders From Apple

Global Semiconductor Sales Witnesses A Massive Quarterly Rise, Recording $166 Billion In Revenue

Private Division

Take-Two Sells Private Division, GTA VI On Track For Release

US Commerce Department Fines GlobalFoundries For "Chip Export" To China's SMIC, Raising Questions On Effectiveness of US Export Policies 1

US Commerce Department Fines GlobalFoundries For “Chip Export” To China’s SMIC, Raising Questions On Effectiveness of US Export Policies

SK Hynix Initiates Supply of Next-Gen HBM4 To NVIDIA For NVIDIA Rubin AI GPUs; Once Again Dominates the HBM Market, Defeating Micron & Samsung 1

NVIDIA CEO Requests SK Hynix To Initiate HBM4 Delivery “Six Months” Earlier, Saying There Is Desperate Need Of Accelerated Performance

Intel Secures Around $8 Billion In New CHIPS Act Grants, Potentially Leading To a Financial Revival 1

US Policymakers Are Reportedly Open To Potential Intel “Merger Deal”, As They Explore Options To Pull Team Blue Out Of The Danger

Samsung Lowers HBM Production Capacity Amid "Sluggish" Business & Failure To Grab Market Opportunities 1

Samsung Expects HBM3E Integration In NVIDIA’s AI Accelerators By Next Quarter, Refuting Rumors of “HBM Business” Fall-Out

Intel's Gaudi 3 AI accelerator

Intel Fails To Achieve Gaudi AI “$500 Million” Revenue Target, Showing Slacking Performance In The AI Segment

Dragon Age: The Veilguard

Dragon Age: The Veilguard’s Turbulent Development Discussed by BioWare Studio Head

TSMC To Receive ASML’s High-NA EUV Equipment By The End Of This Year, Costing a Whopping $350 Million

Samsung employees have started to apply to other companies

Samsung Witnesses a Whopping 40% QoQ Decline In Semiconductor Profits, As They Struggle To Capitalize On AI Boom

OpenAI Develops Its First "In-House" AI Chip, Collaborating With TSMC & Broadcom To Enhance Inferencing 1

OpenAI Develops Its First “In-House” AI Chip, Collaborating With TSMC & Broadcom To Enhance Inferencing

TSMC Expected To Bump Up 3nm & CoWoS Pricing Moving Into 2025 Amid Massive Market Demand & Supply Chain Bottlenecks

SK Hynix Begins Mass-Production of 12-Layer HBM3E Memory: 36 GB Capacity Per Module, 9.6 Gbps Speeds 1

SK Hynix To Integrate 3D Inspection Units To Upscale 12-Layer HBM3E Yield Rates & Production Capacities

Microsoft

Xbox FY25 Q1 Total Gaming Revenue Up by 43%, All From Activision

DFC Intelligence Reports Video Game Industry Gets Strong 2025 Rebound

PlayStation Studios Firewalk Studios

Sony Shuts Down Firewalk Studios, Maker of Concord

NVIDIA's H100 AI Chip

Russia Is Reportedly Getting Access To NVIDIA’s High-End AI Chips Through A Backdoor Present In India, Violating US Export Laws

Intel Unveils Plans To Expand Chengdu Facility In China, Integrating Advanced Chip Packaging Services 1

Intel Unveils Plans To Expand Chengdu Facility In China, Integrating Advanced Chip Packaging Services