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An analyst highlights three things that Qualcomm should focus on

Qualcomm Reportedly Places Advanced Packaging Orders With UMC, Challenging TSMC’s “CoWoS” Dominance

TSMC Denies Helping Intel To Set Up “US Facilities”; Semiconductor Rivalry Heating Up

NVIDIA’s CEO Jensen Huang To Deliver Iconic “CES 2025” Keynote On January 6, Reshaping The Future of Computing Industries

TSMC Details Next-Gen Process Nodes, N3P & N2 to Bring Significant Performance Uplifts 1

TSMC Details Its High-End “2nm Process”, Revealing Massive Performance & Efficiency Improvements

Intel & AMD CPUs Blocked By China: No Government PC To Use Chips From US Companies 1

US To Implement Further “Trade Restrictions” On China, Likely Covering Up Policy Loopholes

AMD To Launch Ryzen AI 300 PRO, 5th Gen EPYC "Turin" & Instinct MI325X On 10th October, Strix Halo & Krackan APUs At CES 2025 1

AMD’s CEO Lisa Su Refutes “Wild” Intel-AMD Merger Rumors, Comments On The Bright Future of AI As Well

Intel Secures Around $8 Billion In New CHIPS Act Grants, Potentially Leading To a Financial Revival 1

Intel’s New co-CEOs Give A Rundown On The Company’s Future; Discussing Business Split-Up, 18A Progress & AI Markets

Intel’s Former CEO Pat Gelsinger Was Against The Company Splitting Up Even Back In 2022, Said Directors Should Hire a “PE Guy” For Such A Decision

TSMC’s Founder Slams Intel’s Business Strategy, Says That They Shouldn’t Have Entered The Chip Business

Chinese AI Startup Founder “Mocks” Effectiveness Of US Trade Policies By Showing Off “Restricted” NVIDIA AI Accelerators & Servers

China Opens Up Antitrust Investigation Against NVIDIA, Citing Anti-Monopoly Law Violations

Intel Foundry Unveils "Innovative" Strategies For Transistors & Packaging Technologies, Enhancing Silicon Scalability

Intel Foundry Unveils “Innovative” Strategies For Transistors & Packaging Technologies, Enhancing Silicon Scalability

Broadcom Unveils "Cutting-Edge" 3.5D XDSiP Technology, Embeds Four Compute Tiles & 12 HBM Sites On A Single Package1

Broadcom Unveils “Cutting-Edge” 3.5D XDSiP Technology, Embeds Four Compute Tiles & 12 HBM Sites On A Single Package

China To Counter "Trump Tariffs" By Preferring "Made-In-China" Goods For Official Use, Combating The Influence Of US Products 1

China To Counter “Trump Tariffs” By Preferring “Made-In-China” Goods For Official Use, Combating The Influence Of US Products

Intel Aims For Leadership In 2025 As Both Panther Lake & Clearwater Forest "18A" CPUs Now Booted-On & Showing Good Health 1

Intel Foundry Fails To Impress Once Again, 18A Process “Yield Rates’ Are Reported To Be Only 10% Making Mass-Production Impossible

TSMC & SK hynix Forms a Strategic AI Alliance, Fueling HBM4 For Next-Gen NVIDIA & AMD GPUs 1

NVIDIA’s Next-Gen “Rubin” Architecture Is Now Rumored To Be Released By “Six Months” Ahead of Schedule

NVIDIA's "Blackwell Ultra" GB300 AI Servers Expected To Debut By Mid-2025, Featuring "Fully-Liquid" Cooling & Much Higher Performant 1

NVIDIA’s “Blackwell Ultra” GB300 AI Servers Expected To Debut By Mid-2025, Featuring “Fully-Liquid” Cooling & Much Higher Performance

Trump Media and Technology Group

Microsoft, HP & Dell Request Suppliers To Ramp Up Production, Preparing For The “Trump-Era” Tariffs

Deadlock Valve

Wolfire and Dark Catt’s Antitrust Lawsuit Against Valve Given Class Action Status

Shuhei Yoshida

Shuhei Yoshida Leaving Sony Interactive Entertainment on January 15, 2025

SK hynix Goes Above & Beyond With World's First 321-Layer & 1 Tb TLC NAND 1

SK Hynix Gains Technological Superiority In The “NAND Flash” Segment, Coming In For Samsung’s Dominance

Intel Should Acquire Qualcomm, Says Analysts

Qualcomm Has “Cooled Off” With The Intel Acquisition Deal, Now Looking Towards Acquiring Certain Divisions

Intel Secures Around $8 Billion In New CHIPS Act Grants, Potentially Leading To a Financial Revival 1

Intel Secures Around $8 Billion In New CHIPS Act Grants, Potentially Leading To a Financial Revival

TSMC To Significantly Upscale “CoWoS” Production Within The Upcoming Quarters, Reaching Up To 130,000 Monthly Output By 2026

NVIDIA Is Still Working Upon Securing AI "HBM" Memory Supply From Samsung, Despite Recent Setbacks 1

NVIDIA Is Still Working Upon Securing AI “HBM” Memory Supply From Samsung, Despite Recent Setbacks

AI Servers Can Reach "Rack Density" Of 1000+ KW Likely With NVIDIA's Next-Gen "Rubin Ultra" Architecture 1

AI Servers Can Reach “Rack Density” Of 1000+ KW Likely With NVIDIA’s Next-Gen “Rubin Ultra” Architecture

Qualcomm's 3rd Gen Oryon CPU Cores Coming To Snapdragon X "AI PC" Platforms In 2025, 2nd Gen Targetting Mobile Segments 1

Qualcomm’s 3rd Gen Oryon CPU Cores Coming To Snapdragon X “AI PC” Platforms In 2025, 2nd Gen Targeting Mobile Segments

Microsoft Unveils NVIDIA's "Blackwell-Based" High-End Azure AI Compute Platform; HPC-Focused Azure AMD EPYC With HBM As Well 1

Microsoft Unveils NVIDIA’s “Blackwell-Based” High-End Azure AI Compute Platform; HPC-Focused Azure AMD EPYC With HBM As Well

TSMC 2nm Process Is Right On-Track, Slated For Mass-Production By 2025 & Sees “All-Time” High Demand

NVIDIA AI server

NVIDIA’s First Blackwell GB200 NVL72 Server Racks Shipped Amidst Reports of Thermal Issues

TensorWave Plans To Build World’s Largest AMD GPU Clusters By 2025, Utilizing Instinct MI300X, MI325X, MI350X AI GPUs & Gigawatt Capacity

ASML Believes Global Semiconductor Markets Will Reach $1 Trillion Valuation By 2023, Driven By Huge AI Demand 1

ASML Believes Global Semiconductor Markets Will Reach $1 Trillion Valuation By 2030, Driven By Huge AI Demand

TSMC's Arizona Facility Opening Is Reportedly Delayed To January 2025, As The Taiwan Giant Prepares For The "Trump Era" 1

TSMC’s Arizona Facility Opening Is Reportedly Delayed To January 2025, As The Taiwan Giant Prepares For The “Trump Era”

Samsung HBM4 Memory In Development For 2025 Debut: 16-Hi Stacks & 3D Packaging 1

Samsung To Develop “Custom HBM4” Solutions For Meta & Microsoft, Signaling A Massive Breakthrough