Samsung’s HBM3E Supply To NVIDIA Looks “Impossible” This Year As The Korean Giant Fails To Meet Industry Standards

Muhammad Zuhair
NVIDIA Is Still Working Upon Securing AI "HBM" Memory Supply From Samsung, Despite Recent Setbacks 1
Image Credits: Samsung

Samsung's HBM3E supply to NVIDIA looks almost "impossible," at least this year, since the Korean giant is still unable to meet industry standards.

Samsung's HBM3E Process Still Unable To Pass NVIDIA's Qualification Tests, Supply Expected To Initiate By Next Year Now

For those unaware, Samsung couldn't secure a position in NVIDIA's supply chain, mainly because it was reported that the firm was unable to pass the qualification tests and the HBM standards set by Team Green. The Korean giant admitted this development in an investor's note, claiming that they are optimistic towards a potential breakthrough; however, a new report by the Korean media outlet Daily Korea says that Samsung's HBM3E supply to NVIDIA this year looks "virtually impossible," but things do look positive in 2025.

Related Story Samsung’s HBM4 Officially Makes Its Way into NVIDIA’s Next-Gen Vera Rubin, Establishing It as the “Industry’s Fastest” AI Memory Solution

It is realistically impossible for Samsung Electronics to supply 8-layer and 12-layer HBM3E to Nvidia this year. The reason for the delay in supply is that we were unable to meet Nvidia's requirements for chip performance.

- Samsung via Daily Korea

Now that it's imminent that Samsung won't supply its HBM products to NVIDIA in 2024, it won't be wrong to say that in the battle for HBM superiority, Samsung's arch-rival SK hynix has taken the lead. It is said that the primary reason behind Samsung not qualifying NVIDIA's sampling is that the bar has been set very high by SK hynix, mainly due to the use of superior methodologies like the "MR-MUF," giving Samsung a hard time in gaining NVIDIA's trust and, ultimately, orders as well.

SK Hynix Begins Mass-Production of 12-Layer HBM3E Memory: 36 GB Capacity Per Module, 9.6 Gbps Speeds 1

Samsung, which once held the throne in the HBM and NAND markets, seems to be losing its hold, given that competitors like SK Hynix and Micron are already supplying components to industry giants, but Samsung is nowhere to be seen. Not just this, but even in the NAND segment, SK hynix has become the "world's first" manufacturer to showcase a 321-layer+ NAND solution, while Samsung, well, the firm, is left behind again here.

However, not everything is gloomy for Samsung, given that the firm is set to be initiating HBM3E supply as early as Q1 2025 to giants like NVIDIA, and with the next-gen HBM4 process, the company is expected to gain a slight edge, given that it has its own semiconductor and memory production lines. But, given that SK hynix has already partnered up with TSMC for HBM4, the Korean giant will likely need to move swiftly to get the industry's attention.

Muhammad Zuhair Photo

About the author: Muhammad Zuhair is a hardware and technology reporter for Wccftech, specializing in the semiconductor industry and the complex interplay between technology, manufacturing, and geopolitics. His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e.g., 2nm process), the economic impact of policies like the CHIPS Act, and the strategic development of AI infrastructure from NVIDIA, AMD and Intel.

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