55%
Plausible
The Exynos 2600’s Heat Pass Block technology has proven to be a vital addition to help effectively transfer heat, with a test comparison showing that this solution outperforms a Snapdragon 8 Elite Gen 5 cooled by liquid nitrogen. However, Samsung isn’t through experimenting with bringing all sorts of upgrades to remove thermal throttling from the equation, as the company is reportedly taking a feature from gaming smartphones to improve sustained performance.
Liquid cooling is being explored by Samsung for its smartphone chipsets as it’s experimenting at its Production Technology Research Institute
With vapor chambers unable to keep the chipset’s temperature under wraps, a report from Sisa Journal states that Samsung is considering the use of liquid cooling. REDMAGIC was the first to pioneer liquid cooling on mobile phones, suggesting Samsung may have been inspired by the smaller firm, which ships fewer handsets than the Korean giant.
A dedicated organization for active cooling solutions has been formed at its Production Technology Research Institute, with the possibility that Samsung also brings air cooling to its Galaxy smartphone range. However, a liquid cooler would not just be more effective than air cooling, but it will also produce less noise and have fewer chances of compromising the dust and water-resistance protection applied to Samsung’s devices.
Unlike REDMAGIC, which proudly displays its cooling loop in its smartphones, Samsung may conceal this technology so its flagships appear cleaner on the outside. Despite employing a vapor chamber on the Galaxy S26 Ultra, it’s still prone to overheating, and seeing as how smartphone chipsets will continue to rise in power draw, there needs to be a robust solution to tackle this problem.
We’ve already discussed in our report that a smartphone’s cooling capabilities have pretty much hit a wall, so it’s high time that companies expand their innovative thinking and prepare some ‘out of the box’ options before it’s too late. Samsung is also reported to bring its side-by-side (SBS) architecture to the upcoming Exynos 2700, with even the Snapdragon 8 Elite Gen 6 Pro said to adopt the Exynos 2600’s Heat Pass Block technology.
In short, the firm likely wants to ensure that the silicon found in its future Galaxy S lineup of devices does not leave any performance on the table. Assuming Samsung succeeds with this approach, we wouldn’t be surprised if its competitors race to bring similar solutions to their premium smartphones.
News Source: Sisa Journal
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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