55%
Plausible
High-Bandwidth Memory (HBM) won’t be limited to servers because the latest report states that Samsung is employing a unique packaging technology that will make smartphones and tablets compatible with these ultra-fast DRAM chips. The goal for the Korean giant is to turbocharge mobile devices into on-device AI beasts, and looking at the profits that Samsung is raking in during the ongoing shortage, the company surely doesn’t want to miss out on any markets.
The objective is to develop HBM technology tailor-made for smartphones and tablets to prevent unnecessary space and power hurdles
Traditional mobile DRAM utilizes copper wire bonding, but their I/O terminal limitations in the 128-256 range mean that there’s tremendous signal loss while boosting efficiency and lowering heat generation. According to ETNews, Samsung intends to equip smartphones and tablets with HBM using ultra-high aspect ratio copper pillars with Fan-Out Wafer Level Packaging (FOWLP), the same packaging used on SoCs like the Exynos 2600 to improve heat resistance and increase sustained workload performance.
Through Samsung’s advancements in Vertical Copper Post Stack (VCS), the manufacturer can ensure that HBM chips thrive in mobile devices despite the size constraints by stacking DRAM dies in a “staircase” configuration and filling the gaps with copper pillars. The report states that Samsung has substantially increased the aspect ratio of copper pillars in VCS packaging from the existing 3-5:1 to 15:1–20:1, boosting bandwidth. Unfortunately, this approach will result in a reduction of the copper pillar diameter.
If this diameter falls below 10 micrometers, these copper pillars can bend or worse, completely break, which is where FOWLP comes into play, offering increased structural integrity by extending the copper wiring outward. The use of FOWLP increases the number of I/O terminals as well, further contributing to a 30 percent increase in bandwidth. Since Samsung is currently developing this technology, it’s difficult to determine when mobile-based HBM will debut.
Looking at the current timeline, Samsung may incorporate it in the Exynos 2800, which is reported to be the company’s first SoC to feature an in-house GPU, or the Exynos 2900. Apple is also said to bring HBM technology to its iPhones, but it’s unconfirmed if the Cupertino firm will source this technology from Samsung. Huawei is also exploring this technology, but it’s unlikely that the Korean manufacturer will enter a Chinese OEM’s supply chain.
Also, given how expensive mobile DRAM has become, we believe that smartphone companies will only begin brainstorming the feasibility of HBM chips in their devices when prices stabilize. Assuming RAM remains ridiculously expensive for the next couple of years, upgrading on-device AI capabilities on smartphones and tablets may remain limited to the chipset and storage.
News Source: ETNews
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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