The 20th-anniversary iPhone will be a special device, different from anything we have seen so far, as the company is working on various technologies to celebrate two decades of the flagship. While the device will be a marvel of engineering in terms of design, Apple is also developing new technologies that enhance the device's performance. It is now being reported that the 2027 iPhone will adopt an advanced AI memory technology for enhanced performance.
Apple’s new AI memory tech promises enhanced performance, power efficiency, and compact design for the 2027 20th anniversary iPhone
According to ETNews, Apple's 20th-anniversary iPhone is expected to house Mobile High Bandwidth Memory (HBM), a type of DRAM that stacks memory chips vertically and connects them through vertical interconnects called Through-Silicon Vias (TSVs). The arrangement's purpose is to enhance signal transmission speeds, which will ultimately allow it to deliver better performance than conventional methods.
HBM is typically used in AI servers, which is where it takes its name from, and it boasts the ability to support AI processing alongside GPUs. HBM is a technology for mobile that specializes in delivering higher data throughput while being enormously power-efficient. It also allows the RAM dies to be significantly smaller in size, which could have additional benefits attached to it, especially as future iPhone models become thinner.
Apple Intelligence has changed the traditional hardware anatomy inside the iPhone, as the company aims to enhance on-device capabilities. ETNews claims that connecting mobile HBM in the 2027 iPhone's GPU units will allow the devices to achieve just that. The technology, once perfected over time, could allow large language models to run locally on the device without hurting battery life or increasing latency.
Apple's memory suppliers, Samsung Electronics and SK Hynix, are already developing the technology for the company, and it is slated to be part of the iPhone in 2027, potentially at the device's 20th anniversary. While both suppliers are working on their own versions of the technology, Samsung is using a packaging method called Vertical Cu-post Stack (VCS), while SK Hynix is using a method called Vertical wire Fan-Out (VFO), and both suppliers aim to begin mass production next year.
Take note that the technology is quite expensive at this stage, which could add to the cost of the 2027 iPhone models. There are now a handful of reasons for Apple to introduce a major price hike for the 2027 iPhone models, but we will share more details on the scenario as soon as further information is available.
About the author: Ali Salman is a technology reporter for Wccftech mobile section with a specialized focus on Apple and the intellectual property that drives mobile innovation. He has cultivated a unique expertise in analyzing and deconstructing complex technology patents, translating dense legal and technical documents into clear, insightful reports on future products.
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