Samsung has decided to step into the next generation of packaging technology as the firm initiates R&D work for "Glass Substrate" adoption by 2026.
Samsung Sees Glass Substrates As The Future of Chip Packaging, Expects It To Be Adopted Within Two Years
The Glass Substrate technology isn't entirely new for the industry since the trend was initially set by none other than Intel a few years ago. While the company created hype for the technology's adoption, they won't be ready for mass production till 2030 despite investing around a billion dollars in their Arizona fab, and to fill this gap, Samsung has joined in the race to enable the adoption and mass production of Glass Substrate chips.
The Korean giant's subsidiary, Samsung Electro-Mechanics, has been entrusted to initiate R&D work on glass substrates and their potential use cases in AI and other emerging fields. Moreover, Samsung is also expected to utilize the work from different divisions, such as their display one, to ensure a collaborative approach with glass substrates moving ahead.
Glass Substrates are indeed a "revolutionary" approach to packaging computer chips to overcome the "cons" associated with traditional methods such as organic packaging.
The technology has numerous benefits, such as higher packaging strength, which ensures more extended durability and reliability, and a higher interconnected density since glass is usually much thinner than organic material, allowing the integration of multiple transistors into a single pack.
Despite the technology's several benefits, the R&D work done on it hasn't been satisfactory, hindering its industry adoption. However, it seems like Samsung has realized that glass substrates could be the future, which is why the firm has planned a collaborative effort to implement the process, using the expertise of its major subsidies.
It is reported that Samsung Electro-Mechanics intends to mass-produce glass substrates by 2026, which isn't far from now, and it will be interesting to see whether the packaging method replaces the conventional ones moving ahead.
News Source: Sedaily
About the author: Muhammad Zuhair is a hardware and technology reporter for Wccftech, specializing in the semiconductor industry and the complex interplay between technology, manufacturing, and geopolitics. His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e.g., 2nm process), the economic impact of policies like the CHIPS Act, and the strategic development of AI infrastructure from NVIDIA, AMD and Intel.
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