Samsung Will Break Ground For New EUV Equipped Plant In Hwaseong, South Korea; While Chasing TSMC’s Tail For 7FF DUV
As we settle down with 10nm processors this year, in 2019, things will get interesting for smartphone microprocessors. When we talk about Samsung’s foundry business, these are not the company’s primary concern. 75% of Samsung’s foundry revenues come from memory chips, leaving a small share for SoCs. The company also holds a small 7.7% share of logic chips. In comparison, TSMC, commands 56% of the same market. Samsung also had a $5 Billion CapEx for the division last year, which once again, falls short when compared to $11 Billion spent by TSMC. Now, the Korean company lays ground for a new foundry in South Korea, expected to put some teeth in its bite. Take a look below for the details.
Samsung Will Conduct Opening Ceremony For Its Hwaseong Plant In South Korea This Friday; EUV Equipment From The Netherlands Will Equip Foundry
While we’ve got the Galaxy S9 and Galaxy S9+ launch coming up in just three days, interesting rumors related to next year’s processors are already the norm. Back in December, Japanese publication Nikkei claimed that Qualcomm will shift to TSMC for the Snapdragon 845’s successor. The San Diego chip maker announces its hardware a calendar year before they make it the market. Keeping that in mind, the Snapdragon 855 will launch later this year.
Some highly optimistic sources also claim that the Galaxy Note9 will feature the processor – but looking at previous trends, these are outlandish. Samsung and TSMC will also switch patterns this year. The former will focus on its 8LPP, while the latter will move to 7FF DUV. To that end, the Korean manufacturer’s announcement comes at an important time.
Samsung’s 8LPP will improve performance efficiency and decrease die area by 10%. It will still use Deep Ultraviolet (DUV) lithography, like current 10nm processors. After 8LPP, Samsung will move to EUV, choosing to term the processors manufactured under it 7nm. TSMC, on the other hand will introduce its 7nm processors early, using DUV for microfabrication. Both TSMC and Samsung will start using EUV tools at the same time, in 2019.
For Samsung, 8LPP vs 10LPP will offer 10% power efficiency and area reduction, as stated above. For TSMC, the company reports 43%(!) improved power efficiency and 37% area reduction with the 7FF DUV, when compared against its direct predecessor. To conclude, Samsung really needs to catch up next year. TSMC’s covered a lot of ground recently. With the Hwaseong plant, Samsung will implement EUV in 2019, and expects to compensate for lost ground next year. Thoughts? Let us know what you think in the comments section below and stay tuned. We’ll keep you updated on the latest.
Source: Korea Herald