Gigabyte X870E AORUS Master X3D ICE
October, 2025Type
MotherboardPrice
$649.99 USCPU Power Consumption Tests
The AMD Ryzen 9000 CPUs come in the same two or three chiplet configurations as the Ryzen 7000 series, with one or two of which are the aforementioned AMD Zen 4 CCDs fabricated on the 4nm process node. Then we have the larger die around the center, the IOD, based on a 6nm process node. The AMD Ryzen 9000 CCD measures a die size of 70.6mm2 and features a total of 8.6 billion transistors per CCD. The IOD has a die size of 122m2 and features 3.4 billion transistors.
Scattered around the package are several SMDs (capacitors/resistors) that usually sit under the package substrate if we consider Intel's CPUs. AMD is instead featuring them on the top layer, and as such, they had to design a new kind of IHS, which is internally referred to as the Octopus.
Power Consumption (Stock System) Stress Test
Power Consumption (Stock) Gaming Test
Power Consumption (Stress PBO+CO) Cinebench Test
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About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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