The AMD Ryzen 9000 CPUs come in the same two or three chiplet configurations as the Ryzen 7000 series with one or two of which are the aforementioned AMD Zen 4 CCDs fabricated on the 4nm process node. Then we have the larger die around the center, the IOD, based on a 6nm process node. The AMD Ryzen 9000 CCD measures a die size of 70.6mm2 and features a total of 8.6 Billion transistors per CCD. The IOD has a die size of 122m2 and features 3.4 billion transistors.
Scattered around the package are several SMDs (capacitors/resistors) that usually sit under the package substrate if we consider Intel's CPUs. AMD is instead featuring them on the top layer and as such, they had to design a new kind of IHS which is internally referred to as the Octopus.
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
Follow Wccftech on Google to get more of our news coverage in your feeds.