Lenovo Legion Go Handheld Teardown Reveals Smaller Cooling Solution, Ryzen Z1 Extreme APU

Muhammad Zuhair
Lenovo Legion Could Be Going Lightweight In New "LITE" Handheld Variant, Powered By AMD Z1 1

Lenovo's Legion Go handheld console has finally received a teardown, revealing the internals of the second AMD Ryzen Z1-powered device.

Lenovo's Legion Go Handheld Console Comes With A Compact Single-Fan Cooling Solution For AMD Ryzen Z1 Extreme APU, Reveals Teardown

The teardown video has been shared on the Chinese social media platform Bilibili, by the famous hardware leaker Golden Pig Upgrade. Starting with the internals, the overall configuration is quite similar to what we have seen with other mainstream handhelds in the market, however, the noticeable difference is the more compact cooling solution, and when compared to its nearest competitor like ASUS's ROG Ally, the difference is quite evident.

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Lenovo Legion Go handheld teardown. Image Source: Golden Pig Upgrade

The first difference is that the Lenovo Legion Go handheld comes with just one fan to dissipate heat out of the chassis whereas the ASUS ROG Ally comes with two fans. The heatsink solution makes use of an aluminum fin design with a single copper heatpipe whereas the ASUS ROG Ally comes with two copper heat pipes and a copper baseplate.

ASUS ROG Ally handheld teardown. Image Source: Dave2D

ASUS had some issues with the heat output of its ROG Ally during launch which it had to fix via firmware updates but early tests have revealed that the Lenovo Legion Go mostly offers the same temperatures as the ROG Ally at the same TDP in gaming.

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Moreover, upon further digging, the user then detached the ABS plastic mounting bracket to unveil the gigantic 49.2 Wh battery, which has taken up a major chunk of space of the device's total size. After revealing the battery compartment, the expert then went into the more exciting part, which is the Lenovo Legion Go's main PCB, which constitutes most of the "goodies".

Lenovo Legion Go Handheld main PCB. Image Source: Golden Pig Upgrade

This particular unit of Legion Go features AMD's Z1 Extreme APU along with 16 GB LPDDR5X-7200 memory, boasting high speeds. For storage purposes, you get up to 1TB PCIe Gen4 SSD and a micro-SD slot supporting up to 2TB of extra storage, which is visible in the M.2 slots shown in the teardown.

The build structure of Lenovo's Legion Go handheld is on par with other devices seen in the global market. The device certainly is larger and has a better screen which makes sense since there's a big battery onboard too but it remains to be seen how the device will hold up in the hands of its first customers when it launches.

Image Source: Microcenter

Lenovo's Legion Go is expected to hit retail by November 1, 2023, with US retailers such as Microcenter already having the device up for pre-orders starting at $799.99 US for the 512 GB, $749.99 US for the 1 TB and $799.99 US for the 2 TB variant.

https://www.youtube.com/watch?v=SW6NIlXSIdk

Handheld Gaming Console Lineup:

NameASUS ROG Ally XMSI CLAW AM1Steam Deck OLEDLenovo Legion GoASUS ROG ALLYAyaneo Air 1SAYANEO 2SAOKZOE A1 ProAOKZOE A2GPD Win Max 2GPD Win 4 (2023)
CPU NameAMD Ryzen Z1 ExtremeIntel Core Ultra Series 1AMD SephirothAMD Ryzen Z1 SeriesAMD Ryzen Z1 SeriesAMD Ryzen 7 7840UAMD Ryzen 7 7840UAMD Ryzen 7 7840UAMD Ryzen 7 7840UAMD Ryzen 7 7840UAMD Ryzen 7 7840U
AMD Ryzen 5 7640U
CPU / GPU Architecture4nm Zen 4 / RDNA 3Meteor Lake / Arc Xe-LPG6nm Zen 2 / RDNA 24nm Zen 4 / RDNA 34nm Zen 4 / RDNA 34nm Zen 4 / RDNA 34nm Zen 4 / RDNA 34nm Zen 4 / RDNA 34nm Zen 4 / RDNA 34nm Zen 4 / RDNA 34nm Zen 4 / RDNA 3
CPU Cores / Threads8 / 16 @ 5.1 GHz16 / 22 @ 4.8 GHz
14 / 20 @ 4.5 GHz
4 / 8 @ 3.5 GHz8 / 16 @ 5.1 GHz8 / 16 @ 5.1 GHz8 / 16 @ 5.1 GHz8 / 16 @ 5.1 GHz8 / 16 @ 5.1 GHz8 / 16 @ 5.1 GHz8 / 16 @ 5.1 GHz8 / 16 @ 5.1 GHz
6 / 12 @ 4.9 GHz
GPU Cores12 CU @ 2.8 GHz8 Xe @ 2.25 GHz
7 Xe @ 2.20 GHz
8 CU @ 1.6 GHz12 CU @ 2.8 GHz12 CU @ 2.8 GHz12 CU @ 2.7 GHz12 CU @ 2.8 GHz12 CU @ 2.7 GHz12 CU @ 2.7 GHz12 CU @ 2.7 GHz12 CU @ 2.7 GHz
8 CU @ 2.6 GHz
Memory24 GB LPDDR5X-750016 GB LPDDR5-640016 GB LPDDR5-640016 GB LPDDR5-750016 GB LPDDR5-640032-64 GB LPDDR5x16 GB LPDDR5x-750032-64 GB LPDDR5x32-64 GB LPDDR5x16 GB LPDDR5x-750016-64 GB LPDDR5x-7500
Storage1 TB (M.2)
Micro-SD UHS-H
512 GB / 1 TB (M.2)512 GB / 1 TB (M.2)512 GB- 2 TB (M.2)512 GB (M.2) +
Micro-SD UHS-H
512 GB - 2 TB (M.2)512 GB - 2 TB (M.2)512 GB- 2 TB (M.2)512 GB - 4 TB (M.2)512 GB - 2 TB (M.2)512 GB - 4 TB
Display Resolution1920x1080 @ 120Hz1920x1080 @ 120Hz1280x800 @90Hz2560x1600 @ 144Hz1920x1080 @ 120Hz1920x1080 @ 60Hz1920x12001920x1200 @ 60Hz1920x12001920x12001920x1200 @60Hz
Screen Type7-Inch7-Inch IPS7.4" OLED8.8-Inch Full IPS7-Inch5.5-Inch Amoled7-Inch Full IPS8-Inch Full IPS7-Inch Laminated IPS10.1-Inch Full IPS6-Inch Full IPS
WiFi OptionWIFI 6E + BT 5.2TBDWIFI 6E + BT 5.3WIFI 6E + BT 5.2WIFI 6E + BT 5.2WIFI 6E + BT 5.2WIFI 6.0 + BT 5.0WIFI 6E + BT 5.2WIFI 6E + BT 5.2WIFI 6.0 + BT 5.0WIFI 6.0 + BT 5.0
Battery Size80Wh53Wh50.0Wh49.2Wh40Wh38Wh50.25Wh65Wh48Wh67Wh45.62Wh
Weight678g675g640g845g608g405gTBD729g649g1005g598g
Form Factor280.2x114x36.9mm294x117x21mm298x117x49mm299x131x41mm28.0 x 11.3 x 3.9mm224x89.5x21.6mmTBD28.5 x 12.5 x 2.1mm265x105x22227 × 160 × 23 mm220 × 92 × 28 mm
Operating SystemWindows 11Windows 11Steam OS/Windows 11Windows 11Windows 11Windows 11Windows 11Windows 11Windows 11Windows 11Windows 11
Release DateJuly 20241H 2024November 2023November 2023May 20232023May 2023May 2023December 2023May 2023August, 2023
Price$799 US$699 (125H + 16 GB + 512 GB)
$799 (155H + 16 GB + 1 TB)
$549 (16 GB + 512 GB)
$649 (16 GB + 1 TB)
$649 (16 GB + 512 GB)
$749 (16 GB + 1 TB)
$799 (16 GB + 2 TB)
$699 (Z1 Extreme)
$599 (Z1 Standard)
$799 (16 GB + 512 GB)TBD$799 US (32 GB +512 GB)$699 US (32 GB + 512 GB)730 EUR (7640U+16+1)
959 EUR (7840U+32+2)
TBD

News Sources: Golden Pig Upgrade , Dave2D

Muhammad Zuhair Photo

About the author: Muhammad Zuhair is a hardware and technology reporter for Wccftech, specializing in the semiconductor industry and the complex interplay between technology, manufacturing, and geopolitics. His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e.g., 2nm process), the economic impact of policies like the CHIPS Act, and the strategic development of AI infrastructure from NVIDIA, AMD and Intel.

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