The 2018 iPhone 9 Will Feature Thinnest LED Backlight Chips, Reducing Its Chin To 2mm
This year, Apple will once again launch three iPhones if consensus on the rumor mill bears fruit. Its iPhone X proved highly popular as the smartphone changed the lineup’s design theme for the first time after the iPhone 6 and iPhone 6 Plus. Additionally, it also introduced the smartphone industry’s first true 3D facial recognition setup with Face ID.
However, the iPhone X failed to solve one problem that continues to neg at Apple’s side. It did not adequately incentivize older users to upgrade, partly owing to its high price tag. This spells trouble for Apple since it continues to rely heavily on the iPhone for revenues. To solve this problem, the company is widely rumored to launch a 6.1″ LCD iPhone 9 this year at a lower price point. Today, we’ve got more details about this device. Take a look below for more details.
Japanese Company Nichia Will Supply Apple With 0.3t LED Backlight Chips For The 2018 iPhone 9; Will Allow For A Reduction In Borders And Chin
Today we’ve got a supply chain report that follows in line with earlier visual leaks of the 6.1″ LCD iPhone 9. Several leaked renders from multiple sources display the device with rather thick borders than found on the iPhone X. This naturally results in a different look from the OLED smartphone, one that is unavoidable due to the nature of display material being used.
A smartphone with thick borders doesn’t do justice to the seamless look (save the notch of course) that Apple finally debuted with its first OLED smartphone. Now, developments in Apple’s supply chain indicate that the company will try to reduce these borders, including the chin which will house the LCD display’s display controller.
For the uninitiated, Apple’s iPhone X is a smartphone without a ‘chin’. The absence of a thick bottom bezel on the smartphone is due to Apple ‘curving’ the OLED display over the display controller and in the process making for a truly bezel-free smartphone. However, the rigidity of LCD panels means that they cannot be curved and therefore, the 6.1″ LCD smartphone will not carry the same aesthetics as the iPhone X.
Nichia’s 0.3t LED Backlight Chips Will Be Harder To Package On The iPhone 9 Than Their 0.4t Counterparts As Company Has Already Commenced Trial Production Of Chips In First Half Of 2018
Apple’s new supply partner Nichia will supply the company with 0.3t LED backlight chips. These will allow Cupertino to reduce the iPhone 9’s borders, especially its chin. When compared against 0.4t. chips, these allow for bottom bezels of height 2.0-2.5mm. The former, increase this measurement to 4.0-4.5mm. Apple’s need to preserve the iPhone X’s overall design on the LCD iPhone 9 is significant if it wants to sell the device as an affordable alternative to the former.
With the smaller chips, the company will try its best. Additionally, supply chain sources also provided a production schedule for the 6.1″ iPhone. The device will enter trial production in the current month. It will then proceed to small-volume and full-volume production in August and September respectively. This should be just in time for Apple to launch the device in September and fulfill the needs of the earliest purchasers of the device.
Apple definitely has a lot riding on the LCD device, and we sincerely hope that the company can achieve its goals with the smartphone. Recent reports suggest that the smartphone will launch in a variety of color options, which might serve to deviate it from the high-end, premium look and feel that Apple and its customers love. Will the gamble pay off? We’ll find out soon enough. Till then, stay tuned and let us know what you think in the comments section below. We’ll keep you updated on the latest.