At 5.5mm thick, the iPhone 17 Air will be Apple’s slimmest device in the smartphone category, and while that might appeal to those who prefer aesthetics over everything else, the truth is that there are some serious trade-offs that will arise, such as the use of an exceptionally small battery. Secondly, a chassis this thin will mean that the device will surely run into thermal throttling problems, meaning that the A19 Pro that is rumored to power the internals will not run at its full potential. However, a new report states that the iPhone 17 Air will feature a technology called ‘Copper Post,’ and in short, it will enable the SoC to run at higher performance despite Apple shaving a few millimeters from its upcoming flagship.
‘Copper Post’ is a semiconductor substrate miniaturization technology that will be used in the iPhone 17 Air for the first time, allowing for the production of components that are up to 20 percent smaller
Even with Apple’s ‘Awe Inspiring’ keynote around the corner, there is a ton of information that we do not know about the company’s upcoming devices. Thankfully, Joongang reports that the technology giant aims to tackle the thermal throttling concern of the iPhone 17 Air with something called ‘Copper Post.’ LG Innotek has developed this technology and it will be commercially used in the sleek flagship for the first time. Typically, the logic board and semiconductor substrate are connected using solder balls.
With ‘Copper Post’ technology, LG Innotek’s method erects copper posts and places semicircular solder balls on top of them, helping to reduce the area and size. This helps with the mass production of semiconductor substrates that are up to 20 percent smaller. This technology gives Apple the required freedom to reduce the thickness of models like the iPhone 17 Air without compromising performance. What is interesting to note is that this Copper Post technology debuted on the ‘communication hip’ of the iPhone 16e that launched earlier this year and will make its way to the iPhone 17 Air.
The same semiconductor substrate miniaturization technology might be applied to the foldable iPhone next year, as it will have two sides that need to be folded and unfolded. Applying Copper Post technology will enable next year’s flagship to ship with a slimmer form factor while also being properly engineered to dissipate heat effectively. Now, all that remains to be seen is whether this change will be a better alternative than the vapor chamber used on the iPhone 17 Pro and iPhone 17 Pro Max.
News Source: Joongang
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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