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Intel Lists Down Coffee Lake-S Based 8 Core Xeon-E CPUs – Rumored To Launch Before Consumer 8 Core Parts, ES In The Wild

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The Intel Coffee Lake-S family was the first to bump the mainstream core count to 6 and it would be the first to go past that too. We have known for some time that Intel is working on a new core bump for the mainstream platform which would take the core count to 8 but there's little info on this part available at the moment.

Intel Xeon-E Mainstream Server Platform To Get 8 Core CPU - Arriving Earlier Than Consumer Platform on LGA 1151 Socketed Motherboards

It has been more than a year since the release of the last Xeon E3 v6 family which was part of the 7th generation Kaby Lake family. While Intel did release mobile Xeon Mobile parts based on 8th generation Coffee Lake family, we have yet to see any new Xeon E v7 update. When Intel released the mobile Xeon E variants under the Coffee Lake family, there were two six-core parts, the Xeon E-2186M and the Xeon E-2176M.

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Now, Intel is planning to bring the Coffee Lake family to Xeon servers on the mainstream market. The new family will feature a range of Coffee Lake chips, ranging from 4 to 6 cores but would also include the first mainstream 8 core parts. It was rumored just a few days ago that Intel's 8 core processors would be arriving in the Xeon mainstream platform first and a recent listing on the Intel technical webpage may seem to confirm that.

Over at Intel's webpage for the 8th generation Coffee Lake-S family, we see the Xeon E Coffee Lake-S lineup listed. Also in the listing is the mention of the 8 core Xeon E processor which seems to be in "ES" state currently. We have already seen various 8 core listings on different benchmark data-based but we can't tell whether that was the consumer-aimed Intel Core part or Intel Xeon version.

The 8 core part is clearly a reaction to AMD delivering a better and faster 8 core solution to gamers and productivity enthusiasts compared to their already great Ryzen 7 1800X. Intel will be aiming their 8 core chip against the Ryzen 7 2700X which will be the top dog for the AMD team on the X470 platform till 7nm arrives. Intel’s 8 Core processors will have 95W and 80W SKUs and will be branded under the Core i9 segment with prices over the $400 US mark.

Intel Desktop Platform Chipset Comparison

Chipset NameAlder Lake-S (ADL-S) PCH / 600 Serie (Z690)Rocket Lake-S (RKL-S) PCH / 500 Series (Z590)Comet Lake-S (CML-S) PCH / 400 Series (Z490)Coffee Lake S (CNL-H) PCH / 300 Series (Z390/H370, B360, Q370, H310)Coffee Lake S (KBL-R) PCH / Z370 Platform
Process NodeTBA14nm14nm14nm22nm
Processor16C,12C,10C,6C,4C (Full corporate/consumer SKU stack at launch)8C, 6C (Full corporate/consumer SKU stack at launch)10C, 8C, 6C, 4C, 2C (Full corporate/consumer SKU stack at launch)
Enhanced IA and Memory Overclocking
Gen 9 Intel Graphics GT2 (Up To 24 EUs)
Corporate/vPro & Consumer
8C, 6C, 4C, 2C (Full corporate/consumer SKU stack at launch)
Enhanced IA and Memory Overclocking
Gen 9 Intel Graphics GT2 (Up To 24 EUs)
Corporate/vPro & Consumer
8C, 6C, 4C (6 Consumer SKUs at Launch)
Enhanced IA and Memory Overclocking
Gen 9 Intel Graphics GT2 (Up To 24 EUs)
Consumer Only
MemoryUp To DDR5-4800 (Native)
Up To DDR4-3200 (Native)
Up To DDR4-3200 (Native)Up To DDR4-2933 (Native)Up To DDR4-2666 (Native)Up To DDR4-2666 (Native)
Media, Display & AudioeDP / 4DDI (DP, HDMI) Display CapabilitiesDP 1.2 & HDMI 2.0, HBR3
HDCP 2.2 (HDMI 2.0a w/LSPCON)
12-bit AV1/HEVC & VP9 10-bit Enc/Dec, HDR, Rec.2020, DX12
Integrated Dual-Core Audio DSP With USB Audio offload
SoundWire Digital Audio Interface
DP 1.2 & HDMI 1.4
HDCP 2.2 (HDMI 2.0a w/LSPCON)
HEVC & VP9 10-bit Enc/Dec, HDR, Rec.2020, DX12
Integrated Dual-Core Audio DSP
SoundWire Digital Audio Interface
DP 1.2 & HDMI 1.4
HDCP 2.2 (HDMI 2.0a w/LSPCON)
HEVC & VP9 10-bit Enc/Dec, HDR, Rec.2020, DX12
Integrated Dual-Core Audio DSP
SoundWire Digital Audio Interface
DP 1.2 & HDMI 1.4
HDCP 2.2 (HDMI 2.0a w/LSPCON)
HEVC & VP9 10-bit Enc/Dec, HDR, Rec.2020, DX12
Integrated Dual-Core Audio DSP
I/O & ConnectivityIntegrated USB 3.2 Gen 2x2 (20G)
Integrated Intel Wireless-AC (Wi-Fi6E/ 7 BT CNVio) with Gig+
Integrated SDXC 4.0 Controller
Thunderbolt 4.0
Integrated USB 3.2 Gen 2x2 (20G)
Integrated Intel Wireless-AC (Wi-Fi6E/ BT CNVi)
Integrated SDXC 3.0 Controller
Thunderbolt 4.0 (Maple Ridge)
Integrated USB 3.2 Gen 2
Integrated Intel Wireless-AC (Wi-Fi / BT CNVi)
Integrated SDXC 3.0 Controller
Thunderbolt 3.0 (Titan Ridge) w/ DP 1.4
Integrated USB 3.1 Gen 1 (5 Gbps)
Integrated Intel Wireless-AC (Wi-Fi / BT CNVi)
Integrated SDXC 3.0 Controller
Thunderbolt 3.0 (Titan Ridge) w/ DP 1.4
Integrated USB 3.1 Gen 1 (5 Gbps)
Thunderbolt 3.0 (Alpine Ridge)
StorageNext-Gen Intel Optane memory
PCIe 5.0, 6x SATA 3.0
Next-Gen Intel Optane memory
PCIe 4.0, 6x SATA 3.0
Next-Gen Intel Optane memory
PCIe 3.0, 6x SATA 3.0
Next Gen Intel Optane memory
PCIe 3.0, 6x SATA 3.0
Next Gen Intel Optane memory
PCIe 3.0, 6x SATA 3.0
SecurityN/AN/AIntel SGX 1.0Intel SGX 1.0Intel SGX 1.0
Power ManagementC10 & S0ix Support for Modern StandbyC10 & S0ix Support for Modern StandbyC10 & S0ix Support for Modern StandbyC10 & S0ix Support for Modern StandbyC8 Support
Launch20222021201920182017

The Xeon E mainstream family is expected to hit the market in late July so we can probably hear something around that time. It would also provide us a glimpse of the performance potential for the 8 core part which comes later in Q3 2018 along with the Intel Z390 platform which won't be a major upgrade over the current and existing Z370 platform.

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