Intel's 15th Gen Arrow Lake CPUs are rumored to utilize different process nodes for the desktop & mobility family. The latest rumor comes from OneRaichu who states that Intel may end up using a different node for each of their Arrow Lake segment, targetting desktops and notebooks.
Intel Rumored To Use TSMC 3nm For Arrow Lake-S "Desktop" & 20A Process Node For Arrow Lake P "Mobile" CPUs
As per official details, Intel has so far confirmed that their 15th Gen Arrow Lake CPUs will target the desktop and mobile platforms. At HotChips, Intel revealed that their Arrow Lake-P SKUs will utilize a 20A process node for the Compute and an external 3nm process node from TSMC for the tGPU (tile GPU). Now as per Raichu, the Intel 15th Gen Arrow Lake Mobile CPUs will be different than the Core Desktop lineup. The desktop lineup is reportedly going to use TSMC N3 process (3nm) which means that Intel will only be fabricating its mobile SKUs themselves while desktop SKUs will be handed to TSMC.
https://twitter.com/OneRaichu/status/1583277425944690688
The Intel 14th Gen Meteor Lake and 15th Gen Arrow Lake Desktop CPUs will be compatible with the LGA 1851 (Socket V1) platform. There are currently little to no details regarding the desktop family but we do have information leaked out and officially revealed for the mobility family which can be read below.
Intel 15th Gen Arrow Lake CPUs: Intel 20A Process Node, Refined Design, Compute & Graphics Leadership, 2024 Launch
The follow-up to Meteor Lake is Arrow Lake and the 15th Gen lineup brings with it a lot of changes. While it would be socket compatible with whatever Meteor Lake lands on, the Redwood Cove cores and Crestmont cores will be upgraded to the brand-new Lion Cove and Skymont cores. These are expected to bring a major advantage with the uplifted core counts which are expected to be 40/48 on the new SKUs (8 P-Cores + 32 E-Cores).
Surprisingly, Intel would skip its 'Intel 4' node and jump directly to 20A for the Arrow Lake CPUs. One thing that's true for both Meteor Lake and Arrow Lake chips is that they will retain their N3 (TSMC) process node for additional core IPs, presumably the Arc GPU cores. The Intel 20A node delivers a 15% improvement in performance per watt, utilizing next-gen RibbonFET & PowerVia tech, and is scheduled to have the first IP test wafers running in fabs by the second half of 2022.
Intel Mobility CPU Lineup:
| CPU Family | Panther Lake | Lunar Lake | Arrow Lake | Meteor Lake | Raptor Lake | Alder Lake |
|---|---|---|---|---|---|---|
| Process Node (CPU Tile) | Intel 18A | TSMC N3B | TSMC N3B | Intel 4 | Intel 7 | Intel 7 |
| Process Node (GPU Tile) | TSMC N3E / Intel 3 | TSMC N3B | TSMC 5nm | TSMC 5nm | Intel 7 | Intel 7 |
| CPU Architecture | Hybrid | Hybrid (Dual-Core) | Hybrid (Triple-Core) | Hybrid (Triple-Core) | Hybrid (Dual-Core) | Hybrid (Dual-Core) |
| P-Core Architecture | Cougar Cove | Lion Cove | Lion Cove | Redwood Cove | Raptor Cove | Golden Cove |
| E-Core Architecture | Darkmont | N/A | Skymont | Crestmont | Gracemont | Gracemont |
| LP E-Core Architecture (SOC) | Darkmont | Skymont | Crestmont | Crestmont | N/A | N/A |
| Top Configuration (Compute Tile) | 4+8 (H-Series) | 4+4 (MX Series) | 6+8 (H-Series) 2+8 (U-Series) | 6+8 (H-Series) 2+8 (U-Series) | 6+8 (H-Series) 8+16 (HX-Series) | 6+8 (H-Series) 8+8 (HX-Series) |
| Max Cores / Threads | 16/16 | 8/8 | 14/14 | 14/20 | 14/20 | 14/20 |
| AI NPU | NPU5 (50 TOPS) | NPU4 (48 TOPS) | NPU3.5 (13 TOPS) | NPU3 (11 TOPS) | NPU2 (7 TOPS) | NPU2 (7 TOPS) |
| Planned Lineup | Core Ultra 300 | Core Ultra 200V | Core Ultra 200 | Core Ultra 100 | 14th/13th Gen | 12th Gen |
| GPU Architecture | Xe3-LPG (Battlemage) | Xe2-LPG (Battlemage) | Xe-LPG+ (Alchemist) | Xe-LPG (Alchemist) | Iris Xe (Gen 12) | Iris Xe (Gen 12) |
| Xe Cores (Max) | 12 Xe3 Cores | 8 Xe2 Cores | 8 Xe Cores | 8 Xe Cores | 96 EUs (768 Cores) | 96 EUs (768 Cores) |
| Memory Support | LPDDR5X-9600 | LPDDR5X-8533 | DDR5-5600 LPDDR5-7500 LPDDR5X-8533 | DDR5-5600 LPDDR5-7400 LPDDR5X - 7400+ | DDR5-5200 LPDDR5-5200 LPDDR5-6400 | DDR5-4800 LPDDR5-5200 LPDDR5X-4267 |
| Memory Capacity (Max) | 128 GB | 32 GB | 128 GB | 96 GB | 64 GB | 64 GB |
| Thunderbolt Support | TB5 | TB5 | TB5 | TB4 | TB4 | TB4 |
| WiFi Capability | WiFi 7 | WiFi 7 | WiFi 7 | WiFi 6E | WiFi 6E | WiFi 6E |
| TDP | 17-45W | 17-30W | TBD | 7W-45W | 15-55W | 15-55W |
| Launch | 2H 2025 | 2H 2024 | 2H 2024 | 2H 2023 | 1H 2023 | 1H 2022 |
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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