AORUS LGA 3647 Socketed Motherboard With Hexa Channel Support Was Running Intel’s Cascade Lake-X 28 Core CPU

Jun 8, 2018

A few hours ago, Intel demoed their 28 core, 56 thread Core-X processor but little did we know that this processor is actually running on the new LGA 3647 platform instead of LGA 2066 like current processors do.

Intel’s 28 Core Monster Processor Was Running on an LGA 3647 Platform With Hexa Core Memory Support

We all saw the uninformative demo of a 28 core, 56 thread processor which was announced by Intel. They didn’t tell the name, they didn’t tell what boards would support it, they didn’t even tell what family would it be part of. But that’s no problem for us, a good eye by one of our editors is all that’s needed as he sent me this interesting shot of what looks like a completely different platform for high-end desktop PCs than the one we are used to.

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The close-shot clearly shows six DIMMs and not four DIMMs like current X299 motherboards. The LGA 3647 platform features hexa channel memory support and that is my point. What we are looking at is the first LGA 3647 motherboard which is not a prototype, but an actual functioning one from AORUS. The socket should be surrounded by a total of 12 DIMM slots and that would be stunning and expensive for HEDT builders as memory prices still aren’t where they are supposed to be.

Also, we can clearly note a more rectangular cooler mounting on the socket instead of a square one. The LGA 3647 socket is known to be more rectangular than the squarish one on the X299 ones. The system was using a very high-end chiller cooler and a Corsair AX1600i PSU s and power consumption was off the charts. Also speaking about TDP, we are expecting it to be around 200-250W since Xeon Platinum’s max out at 205W with conservative clock speeds. So if Intel is going with higher clock speeds on the enthusiast side, we may expect TDP to take a slight jump too so in the same ballpark as AMD’s 250W Ryzen Threadripper 2nd Gen (32 core) parts.

There’s also some talk that Intel will be abandoning X299 motherboards entirely. However, when talking to some sources during Computex, we got to hear that Intel is planning to keep X299 for a while and it would exist alongside the new ultra high-end LGA 3647 platform which launches at the end of this year. Some board partners also hinted that the motherboards won’t be ready till early 2019 since there’s lots of VRM changes and board design changes from the server side to be made to make this platform a sustainable and sensible solution, even for high-end desktop users.

The 28 core processor could be the flagship model of this lineup and it is supposed to launch in Q4 2018. Intel is clearly running the demo on the Xeon Platinum processors since we know that Intel is also repurposing Xeon W parts for the Core-X family. So it won’t be a surprise to see processors that look an awful lot similar to Xeon Platinum but have a Core i9 branding on top. This means we will see multiple variants with different core configs at launch. Price remains unknown at this point but we are definitely gonna be updating you with more information.

Intel HEDT Processor Families:

Intel HEDT Family Gulftown Sandy Bridge-E Ivy Bridge-E Haswell-E Broadwell-E Skylake-X Skylake-X Skylake-X Cascade Lake-X
Process Node 32nm 32nm 22nm 22nm 14nm 14nm+ 14nm+ 14nm+ 14nm++
Flagship SKU Core i7-980X Core i7-3960X Core i7-4960X Core i7-5960X Core i7-6950X Core i9-7980XE Core i9-9980XE Xeon W-3175X TBD
Max Cores/Threads 6/12 6/12 6/12 8/16 10/20 18/36 18/36 28/56 18/36
Clock Speeds 3.33/3,60 GHz 3.30/3.90 GHz 3.60/4.00 GHz 3.00/3.50 GHz 3.00/3.50 GHz 2.60/4.20 GHz 3.00/4.50 GHz 3.10/4.30 GHz TBD
Max Cache 12 MB L3 15 MB L3 15 MB L3 20 MB L3 25 MB L3 24.75 MB L3 24.75 MB L3 38.5 MB L3 24.75 MB L3
Max PCI-Express Lanes (CPU) 32 Gen2 40 Gen2 40 Gen3 40 Gen3 40 Gen3 44 Gen3 44 Gen3 44 Gen3 44 Gen3
Chipset Compatiblity X58 Chipset X79 Chipset X79 Chipset X99 Chipset X99 Chipset X299 X299 C612E X299
Socket Compatiblity LGA 1366 LGA 2011 LGA 2011 LGA 2011-3 LGA 2011-3 LGA 2066 LGA 2066 LGA 3647 LGA 2066
Memory Compatiblity DDR3-1066 DDR3-1600 DDR3-1866 DDR4-2133 DDR4-2400 DDR4-2666 DDR4-2800 DDR4-2666 DDR4-2933
Max TDP 130W 130W 130W 140W 140W 165W 165W 255W 165W?
Launch Q1 2010 Q4 2011 Q3 2013 Q3 2014 Q2 2016 Q3 2017 Q4 2018 Q4 2018 2H 2019
Launch Price $999 US $999 US $999 US $1059 US $1700 US $1999 US $1979 US ~$4000 US TBD
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