It’s Official: IBM Launches The 5nm GAAFET Chip With 30 Billion Transistors Per 50mm², 75% Power & 40% Performance Boost


We've got some big new for you today folks. The big news in mobile recently is the introduction of 10nm FinFET. Samsung and Qualcomm have brought the process on their chips and the manufacturers promise significant battery and performance boosts. But, as we've been telling you for quite a while, things move fast in the tech world. But just how fast? Take a look below to find out more.

IBM Unveils The World's First 5nm Chip In Collaboration With Samsung; Promises Up To 40% Performance Boost

It's a big advancement by IBM and Samsung to move towards. The time of FinFET is gone folks, and now its time to move forward to GAAFET. While FinFET was the first to move towards a 3D node, with GAAFET, we now get a mix of FinFET and 2D. For GAAFET, each transistor consists of three nanosheets stacked on top of each other, surrounded by gate material. With GAAFET, IBM stacks layers of silicon and silicon germanium over each other.

AWS Graviton3 CPU Detailed: 55 Billion Transistors, 7 Chiplet Design With 64 Cores & DDR5 Memory Support

The SiGe is then removed and the space is filled with a high-k gate material. This brings down patterning complexity significantly, which in turn will drive down manufacturing costs in the fabrication industry after a long time. This chip is also the first time Extreme Ultra-Violet lithography is used for front line patterning, according to IBM's Huiming Bu. Looks like EUV's time is finally here.

As far as transistors go, IBM claims that it can fit in up to 30 Billion transistors on the chip using GAAFET on a 50 mm² chip. It's a big move in the semi-conductor world, as designs become increasingly complicated to apply. IBM claims that when 5nm GAAFET is compared to 10nm commercial chips, you'll get a 40% performance boost or an amazing 75% power consumption reduction, at similar performance levels. These are some big claims folks, so expect some big changes just around the corner. 

Right now, it's expected that both Samsung and TSMC will commence risk production for 7nm next year. It's currently time for 10nm, but IBM really has upped the bar today. Given that the 5nm chip has been produced in collaboration with Samsung, maybe the South Korean tech giant has got more up its sleeve than its letting on. Thoughts? Let us know what you think in the comments section below and stay tuned. We'll keep you updated on the latest.