- 0-20%: Unlikely - Lacks credible sources
- 21-40%: Questionable - Some concerns remain
- 41-60%: Plausible - Reasonable evidence
- 61-80%: Probable - Strong evidence
- 81-100%: Highly Likely - Multiple reliable sources
50%
Plausible
Samsung is expected to adopt even higher cooling standards for its upcoming Exynos 2700, with its efforts exceeding those it made with the Exynos 2600. According to one rumor, this will happen by changing the packaging of the SoC, where the DRAM module will be kept separate from the silicon. With this change, the Exynos 2700 will tame its thermals better, delivering better sustained performance.
Apple’s A20 Pro and Exynos 2700 are currently the only chipsets focusing on packaging changes to improve thermals
With the Exynos 2600, Samsung employed the use of smaller LPDDR5X RAM placed next to the SoC die, with the Heat Pass Block (HPB) heatsink placed on top of the silicon to improve heat dissipation. With additional insight from ExoticSpice, we learn that the Exynos 2700 will switch things up, with the chipset packaging no longer housing the memory module, as the latter is kept separately.
Since the Exynos 2600’s DRAM was spaced closely with the silicon, there was still a chance of thermal throttling as the memory chip was placed next to the SoC. With the Exynos 2700 observing a similar packaging to the A20 Pro’s WMCM (Wafer-Level Multi-Chip Module), also known as Side-by-Side (SbS) architecture, it’ll also have the added benefit of having the HPB on top of the Exynos 2700 for better heat dissipation.
Furthermore, the HPB will be aided by a vapor chamber that’s said to be adopted with various Galaxy S27 models scheduled to launch in Q1 2027. Looking at these changes, it’s clear that the Exynos 2700 and A20 Pro are currently focused on bringing thermal improvements. The Snapdragon 8 Elite Gen 6 Pro has also been leaked to feature a Heat Pass Block, but its implementation is rumored to be inferior to Exynos’.
As for MediaTek’s Dimensity 9600, it’s possible that it doesn’t offer any add-ons to help with heat dissipation, making it potentially the least advanced SoC in this regard. Hopefully, MediaTek can learn a thing or two from Apple and Samsung.
News Source: ExoticSpice
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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