Cadence’s AuraStack AI Stack Addresses The PCB & Advanced Packaging Bottleneck That Is Eating 65% Of Engineers’ Time, With NVIDIA & TSMC Already Deploying It

Cadence has announced its new AuraStack AI Super Agent, which aims to solve PCB & advanced packaging bottlenecks by leveraging Agentic AI.

Cadence's AuraStack AI Super Agent Brings The World's First Agentic AI Platform To PCB & Advanced Packaging Manufacturing, Solving One of The Biggest Bottlenecks That The Tech Industry Faces Right Now

The Cadence AuraStack AI Super Agent runs on the company's Allegro AI Studio and is the first Agentic AI platform that is built for PCB and Advanced Packaging design. The stack allows PCB designers to take planned systems into a final product through a single AI-native environment.

2 of 9

Powered by the NVIDIA Blackwell and CUDA-X architecture, the Cadence AuraStack AI Super Agent coordinates domain-specific AI agents across planning, implementation, and tightly integrated multiphysics analysis domains to compress the system-design cycle through the manufacturing stages.

Cadence today introduced the AuraStack AI Super Agent, the world’s first agentic AI platform for printed circuit boards (PCB) and advanced packaging design. With 65% of engineers’ time consumed by abstract tasks, the bottleneck isn’t automation—it’s engineering intelligence.

AuraStack AI Super Agent has multiple benefits. It boosts the time-to-market by up to 2x with a 15x increase in productivity and multiphysics-driven quality; it unifies separate engineering teams around a shared, multi-physics-aware design environment and advanced early and continuous multiphysics co-optimization to reduce late-stage rework and costly design iterations. Limiting expensive respins is also a major advantage that you get with the AI-powered stack, and with its product-level optimization for advanced packaging solutions, you get faster manufacturing.

2 of 9

The AuraStack AI Super Agent’s key benefits include:

• Accelerating time to market by 2X, with 15X productivity and multiphysics-driven quality—automating complex tasks, expanding design exploration.
• Unifying separate engineering teams around a shared, multiphysics-aware design environment with a single source of truth across domains.
• Advancing early and continuous multiphysics co-optimization to reduce late-stage rework and costly design iterations. Unifies Cadence multiphysics signoff solutions, such as Celsius Thermal Solver, Clarity 3D Solver for 3D-EM, MSC Nastran and Marc Linear and Non-Linear Finite Element Analysis Solvers for mechanical analysis, and Sigrity X Platform for signal and power integrity.
• Limiting expensive respins by identifying system issues earlier in development.
• Enabling product-level optimization, including co-optimization with advanced packaging approaches.

Cadence is working with multiple industry leaders to deploy AuraStack AI Super Agent to their workflows to address advanced IC packaging and PCB design challenges.

NVIDIA is using it to automate and optimize increasingly complex system design workflows for its engineering teams. TSMC is also using the Agentic AI stack to accelerate advanced packaging implementation by leveraging AI-driven automation, enabling a timely design convergence for increasingly complex multi-die systems.

NVIDIA x Cadence

“The scale and complexity of modern AI infrastructure demands a new design approach,” said Tim Costa, vice president and general manager of computational engineering at NVIDIA. “NVIDIA's collaboration with Cadence is advancing AI-powered engineering workflows that accelerate design convergence and innovation across the industry. The Cadence AuraStack AI Super Agent and the Millennium M2000 Supercomputer deliver up to 20X faster multiphysics performance, giving our engineers the capability to tackle the most demanding design challenges and bring the next generation of AI infrastructure to life.”

TSMC x Cadence

“As advanced packaging complexity grows, customers need new levels of automation to achieve timely design convergence,” said Aveek Sarkar, director of the Ecosystem and Alliance Management Division at TSMC. “Our long-standing partnership with Open Innovation Platform® (OIP) ecosystem partners like Cadence to deliver advanced package design and verification solutions for TSMC 3DFabric® technologies helps customers accelerate the realization of next-generation multi-die systems for AI and high-performance computing applications. Through our multi-year collaboration on substrate auto routing, we are already enabling customers to boost productivity by 100X while delivering quality of results similar to manual routing.”

With the release of the AuraStack AI Super Agent, Cadence becomes the world's only provider of an Agentic AI solution stack that spans the full electronic system design flow, from digital & analog silicon design to advanced packaging, PCB design, and more. These solutions will help address the limitations that the advanced packaging and PCB manufacturing firms currently face.

Follow Wccftech on Google to get more of our news coverage in your feeds.