TSMC appears to be experiencing raging success with its SoIC (system on integrated chips) advanced packaging, likely because of the benefits that this technology brings to the table. However, another report states that there are two companies that are the driving force behind the Taiwanese semiconductor giant’s growth, with one of them being Apple. For those who do not know, SoIC packaging differs from an SoC, and there is a possibility that this technology is applied to the Cupertino firm’s chipsets later this year.
A previous report stated that Apple’s higher-tier M5 versions would adopt TSMC’s SoIC packaging
The partnership between Apple and TSMC has expanded beyond the mass production of SoCs, as the iPhone maker has previously been mentioned to be exploring the use of SoIC packaging, which brings lowered power consumption and other advantages to the table. According to Economic News Daily, increased orders from Apple and AMD have allowed the semiconductor manufacturer to witness ‘explosive’ growth in this area.
It is unclear how many wafers of this technology have been pre-ordered, but a previous report mentioned that TSMC will ramp up production of SoIC packaging by the end of 2025. Apart from Apple and AMD, NVIDIA’s Rubin architecture was also mentioned to leverage this technology, but interestingly enough, the latest report does not talk about the graphics chip titan. TSMC is also said to shift its focus from CoWoS (Chip on Wafer on Substrate) to SoIC as its three aforementioned customers apparently desire to showcase their next offerings on this technology.
Later this year, we might see TSMC’s SoIC efforts pay off, as Apple is said to adopt this packaging to the M5 series, which will be found in the company’s updated 14-inch and 16-inch MacBook Pro models. Unfortunately, the base model will reportedly be omitted from utilizing this packaging, with the M5 Pro and possibly the more powerful variants said to take advantage of it. As for the benefits, SoIC packaging allows for two advanced chips to be stacked directly on top of each other, allowing for ultra-dense connections between those chips, resulting in reduced latency, increased performance, and efficiency.
During the company’s 2024 Symposium, TSMC appeared very optimistic about SoIC adoption, believing that around 30 designs will be released between 2026 and 2027. What we could witness in late 2025 is the first of many iterations, with Apple potentially jump-starting this trend.
News Source: Economic News Daily
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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