The iPhone 17 series is reported to stick with TSMC’s 3nm node, though Apple is expected to move to the new ‘N3P’ variant, which means that the A19 and A19 Pro will not transition to the 2nm technology next year. As for 2026, when the technology giant is said to unveil the iPhone 18, the new chipsets, which will chronologically be named A20 and A20 Pro, are said to tout the new lithography, along with gravitating to a new packaging by ditching InFo, or Integrated Fan-Out.
New WMCM packaging for the 2nm A20 and A20 Pro will allow for the development of more complex components being a part of a single die
One of the reasons why Apple is not immediately jumping to the 2nm manufacturing process in 2025 for the iPhone 17 lineup is due to high wafer costs, so it will likely be reserved for some iPhone 18 models. According to a Weibo user with a handle that is machine translated into ‘Mobile phone chip expert,’ the A20 and A20 Pro, which are expected to be unveiled two years from now, will not just leverage TSMC’s 2nm technology but will also flaunt a new WMCM, Wafer-Level Multi-Chip Module, and a 12GB RAM upgrade.
The current-generation A18 and A18 Pro employ TSMC’s InFo technology, which allows for the integration of components within the package. The main focus is single-die packaging, where memory is typically attached to the main SoC, with the DRAM placed on top or near the CPU and GPU cores. This approach optimizes size reduction while improving performance.
As reported by MacRumors, WMCM, or Wafer-Level Multi-Chip Module, integrates multiple chips within the same package. This allows for the development of more complex chipsets, with components such as the CPU, GPUs DRAM, Neural Engine and others to be integrated in one package. Apple might choose this packaging because it allows for greater flexibility in arranging various chips.
For instance, with WMCM, Apple can choose to stack chips vertically or place them side by side. This packaging should also help scale the chips’ performance based on which category of devices they are being made for. The Cupertino firm could develop the M6 using the 2nm process while taking advantage of Wafer-Level Multi-Chip Module packaging to develop more powerful versions, such as the M6 Ultra. Of course, since this information is classified as just a rumor, we will treat it with a pinch of salt and have more updates ready in the future.
News Source: Mobile phone chip expert
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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