Apple’s 2026 Mac lineup might look familiar on the outside, but under the hood, the machines will feature a subtle change in how their processors are built. The change will pave the way for a major performance jump and efficiency gains in the coming years. According to the latest information, the company’s next-generation M5 chips for high-end MacBook Pro models will adopt a new Liquid Molding Compound (LMC), which will be exclusively supplied by Taiwan’s Eternal Materials, according to industry analyst Ming-Chi Kuo.
Next-gen MacBook Pros adopt advanced LMC packaging, positioning Apple for powerful, efficient multi-die processors with future CoWoS support
If you are not familiar, the shift in technology is more than just about suppliers, as Eternal Materials’ LMC is designed and engineered to meet the demanding specifications of TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) packaging. These are the same standards used in high-performance computing chips and AI accelerators. CoWoS also allows multiple chiplets to be stacked or placed side by side in a single package, which ultimately results in increased bandwidth and computational density.
Take note that next year’s M5 Macs will not use full CoWoS yet, but it will still play a crucial role, as adopting a compatible material now will be a wise and deliberate action for future iterations. In the short run, the Liquid Molding Compound (LMC) will deliver practical benefits, which include structural integrity, better heat dissipation, and enhanced manufacturing efficiency. All of these benefits will contribute to consistent performance and improved efficiency. Kuo also highlighted the changes coming for the A20 series of chips next year with the 20th anniversary iPhone, so be sure to check that out as well.
From the supply chain point of view, Eternal Materials secured the contract after outperforming Japanese suppliers Namics and Nagase. The shift also marks a notable sourcing strategy from Apple, giving Taiwan-based suppliers a larger role in advanced chip materials while giving itself more flexibility in control and research collaborations. Take note that Apple is laying the groundwork for future M6 or M7 series chips, which could fully adopt CoWoS or even CoPoS, which is Chip-on-Package-on-Substrate.
This would allow Apple to build larger and more complex processors capable of handling increasingly demanding workloads, ranging from AI model training to high-end 3D rendering, with significantly higher memory throughput. As for the M5 chips in 2026 Macs, the processor will deliver the performance that users are expecting, along with efficiency gains.
Apple has also delayed the launch of its M5 chip, which is expected to arrive early next year with the MacBook Pro models, and possibly, the switch could be the reason why. The company also plans to announce a refreshed version of the MacBook Pro later in 2026, which could be powered by the M6 chip. Do you think Apple’s move to CoWoS-ready packaging will lead to a major leap in performance? Let us know your thoughts in the comments.
About the author: Ali Salman is a technology reporter for Wccftech mobile section with a specialized focus on Apple and the intellectual property that drives mobile innovation. He has cultivated a unique expertise in analyzing and deconstructing complex technology patents, translating dense legal and technical documents into clear, insightful reports on future products.
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