AMD Zen 6 “Ryzen” CPUs Reportedly Codenamed Medusa, Feature 2.5D Interconnect With Increased Bandwidth

Hassan Mujtaba
AMD Zen 6 "Ryzen" CPUs Reportedly Codenamed Medusa, Feature 2.5D Interconnect With Increased Bandwidth 1

AMD's next-gen Zen 6 CPUs for clients which include Ryzen chips will reportedly be labeled under the "Medusa" codename.

AMD's Next-gen Zen 6 Client CPUs To Be Codenamed "Medusa" & Feature Higher-Bandwidth 2.5D Interconnects

Based on information shared by @Olrak29_, it looks like AMD has finalized the codename for its client desktop CPUs based on the next-gen Zen 6 architecture. The upcoming Zen 5 desktop CPU lineup will fall under the Granite Ridge codename while the Zen 6 desktop CPU lineup will feature the Medusa codename. These chips aren't expected to arrive until late 2025 / early 2026 so it will be some time before AMD officially starts sharing information on them as even Zen 5 isn't detailed much (officially).

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In addition to the codename, it also looks like AMD's Zen 6 client CPUs, or Medusa, will be utilizing a brand new interconnect based around a 2.5D chiplet design. This design is said to allow for higher chip-to-chip bandwidth so that the Zen 6 CCDs can communicate faster through each CCD and also with the IOD.

A die representation was showcased using a Navi 31 GPU with the two MCD stacks representing the dual CCDs and the small portion of the GCD representing the IOD. This might hint that the Zen 6 "Ryzen" CPUs might once again adopt a dual CCD chiplet design with a single IO die. The IOD might get bigger to incorporate next-gen technologies but we can't say for sure right now.

Some additional details pointed out are that Medusa CPUs (Ryzen Zen 6 Desktop) will not be stacking the CCDs on top of the IOD due to higher costs associated with such designs. AMD might experiment with these designs in the future as they did with 3D V-Cache stacking on Ryzen 5000 chips and further matured it with the Ryzen 7000 SKUs. Based on previous information, the AMD Zen 6 core architecture is codenamed "Morpheus" and is going to launch by 2025-2026.

With the launch of Zen 5 all set for 2024, we can expect the company to start sharing more info on its next-gen Zen 6 architecture and the respective products once they are done with the upcoming releases.

AMD Zen CPU / APU Roadmap:

Zen ArchitectureZen 7Zen 6CZen 6Zen 5 (C)Zen 4 (C)Zen 3+Zen 3Zen 2Zen+Zen 1
Core CodenameTBAMonarchMorpheusNirvana (Zen 5)
Prometheus (Zen 5C)
Persphone (Zen 4)
Dionysus (Zen 4C)
WarholCerebrusValhallaZen+Zen
CCD CodenameTBATBATBAEldoraDurangoTBCBrekenridgeAspen HighlandsN/AN/A
Process NodeTBA3nm/2nm?2nm/3nm3nm4nm6nm7nm7nm12nm14nm
ServerTBAEPYC Venice (6th Gen)EPYC Venice (6th Gen)EPYC Turin (5th Gen)EPYC Genoa (4th Gen)
EPYC Siena (4th Gen)
EPYC Bergamo (4th Gen)
N/AEPYC Milan (3rd Gen)EPYC Rome (2nd Gen)N/AEPYC Naples (1st Gen)
High-End DesktopTBATBATBARyzen Threadripper 9000 (Shamida Peak)Ryzen Threadripper 7000 (Storm Peak)N/ARyzen Threadripper 5000 (Chagal)Ryzen Threadripper 3000 (Castle Peak)Ryzen Threadripper 2000 (Coflax)Ryzen Threadripper 1000 (White Haven)
Mainstream Desktop CPUsTBATBARyzen **** (Olympic Ridge)Ryzen 9000 (Granite Ridge)Ryzen 7000 (Raphael)Ryzen 6000 (Warhol / Cancelled)Ryzen 5000 (Vermeer)Ryzen 3000 (Matisse)Ryzen 2000 (Pinnacle Ridge)Ryzen 1000 (Summit Ridge)
Enthusiast Mobile CPUsTBATBARyzen **** (Gator Range)Ryzen 9000HX (Fire Range)Ryzen 7000HX (Dragon Range)N/AN/AN/AN/AN/A
Mainstream Desktop . Notebook APURyzen AI 500 (Sound Wave)?Ryzen AI 500 (TBA)Ryzen AI 400 (Medusa Point / BB)Ryzen AI 300 (Strix Point)
Ryzen *** (Krackan Point)
Ryzen 7000 (Phoenix)Ryzen 6000 (Rembrandt)Ryzen 5000 (Cezanne)
Ryzen 6000 (Barcelo)
Ryzen 4000 (Renoir)
Ryzen 5000 (Lucienne)
Ryzen 3000 (Picasso)Ryzen 2000 (Raven Ridge)
Low-Power MobileTBATBATBARyzen *** (Escher)Ryzen 7000 (Mendocino)TBATBARyzen 5000 (Van Gogh)
Ryzen 6000 (Dragon Crest)
N/AN/A

Hassan Mujtaba Photo

About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.

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