Given the hype around AMD's Ryzen AI 300 "Strix" APUs, the firm is rumored to release more powerful SKUs within the family.
AMD Plans To Enhance The Ryzen AI 300 Series Through New & Advanced APUs, Likely Pointing To Strix Halo Lineup
AMD's Ryzen AI 300 "Strix" APUs are by far one of the most competitive offerings in the AI PC race, competing head to head with Qualcomm's Snapdragon X Elite alternatives in the markets. The existing SKUs are a favorite for OEMs like ASUS, which is why the firm has designed a decorated product lineup around the architecture.
However, to sustain the hype, the famous leaker Golden Pig Upgrade now reports that AMD plans on introducing additional SKUs in the Strix Point lineup, adding that they are going to be "bigger" ones, which means they are more capable.
Currently, AMD's Ryzen AI 300 "Strix" APU lineup consists of the Ryzen AI 9 HX 370 and the Ryzen AI 9 365, both of which are highly capable in their respective domains, but it looks like further APUs are being cooked by AMD, and this also makes sense since its kind of weird to have only two SKUs within the family although the scale a much wider TDP range (15-54W) which eliminates the need to have different segments such as HS/H/U series.
Unfortunately, the leaker didn't provide us with details regarding the specifics of the SKUs, apart from the fact that they will be more powerful than the existing ones. Based on this, we can make an assumption. Team Red plans to introduce new SKUs within the Ryzen 9 AI branding, that's for sure. The company could decorate the naming scheme by adding new models, such as the Ryzen 9 AI 385 or something similar, but that's not conclusive yet. The leaker also points out "Ryzen AI Max Plus" as a tentative branding which will make it similar to Apple's SOCs.
Another interesting approach here would be for AMD to add "300-series" SKUs to the upcoming Strix Halo APUs, which are set to launch sometime in 2025. Given that Strix Point and Strix Halo share many similarities in terms of architecture but totally different implementations (monolithic versus chiplet), Team Red might go with higher SKU names within the Ryzen AI 300 series which makes sense, but that would make things conflicting, especially in terms of the naming schemes. Or, the more simple approach here would be that the leaker is hinting towards the "Ryzen AI PRO" models, which are rumored to drop by October.
AMD Ryzen AI HX Strix Halo Expected Features:
- Zen 5 Chiplet Design
- Up To 16 Cores
- 64 MB of Shared L3 cache
- 40 RDNA 3+ Compute Units
- 32 MB MALL Cache (for iGPU)
- 256-bit LPDDR5X-8000 Memory Controller
- XDNA 2 Engine Integrated
- Up To 60 AI TOPS
- 16 PCIe Gen4 Lanes
- 2H 2024 Launch (Expected)
- FP11 Platform (55W-130W)
AMD likes to surprise us at the last minute, so we won't be shocked if a random Ryzen AI 300 "Strix" SKU drops out of nowhere. For now, we will have to wait and see how things unfold.
AMD Ryzen AI 300 "Strix/Krackan" APUs:
| CPU Name | Cores / Threads | Core Config | Clock Speeds (Max) | Cache (Total) | AI Capabilities | iGPU | TDP |
|---|---|---|---|---|---|---|---|
| Ryzen AI 9 HX 375 | 12/24 | 4x Zen 5 / 8x Zen 5C | 2.0 / 5.1 GHz | 36 MB / 24 MB L3 | 85 AI TOPs (55 TOPS NPU) | Radeon 890M (16 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 9 HX 370 | 12/24 | 4x Zen 5 / 8x Zen 5C | 2.0 / 5.1 GHz | 36 MB / 24 MB L3 | 80 AI TOPs (50 TOPS NPU) | Radeon 890M (16 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 9 HX PRO 370 | 12/24 | 4x Zen 5 / 8x Zen 5C | 2.0 / 5.1 GHz | 36 MB / 24 MB L3 | 80 AI TOPs (50 TOPS NPU) | Radeon 890M (16 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 7 365 | 10/20 | 4x Zen 5 / 6x Zen 5C | 2.0 / 5.0 GHz | 30 MB / 20 MB L3 | 80 AI TOPs (50 TOPS NPU) | Radeon 880M (12 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 7 PRO 360 | 8/16 | 3x Zen 5 / 5x Zen 5C | 2.0 / 5.0 GHz | 24 MB / 16 MB L3 | 72 AI TOPs (50 TOPS NPU) | Radeon 880M (12 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 7 350 | 8/16 | 4x Zen 5 / 4x Zen 5C | 2.0 / 5.0 GHz | 24 MB / 16 MB L3 | 66 AI TOPs (50 TOPS NPU) | Radeon 860M (8 CU @ 3.0 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 5 340 | 6/12 | 3x Zen 5 / 3x Zen 5C | 2.0 / 4.8 GHz | 22 MB / 16 MB L3 | 59 AI TOPs (50 TOPS NPU) | Radeon 840M (4 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 5 330 | 4/8 | 1x Zen 5 / 3x Zen 5C | 2.0 / 4.5 GHz | 12 MB / 8 MB L3 | 50 TOPS (NPU) | Radeon 820M (2 CU @ 2.8 GHz) | 28W (cTDP 15-54W) |
News Source: Weibo
About the author: Muhammad Zuhair is a hardware and technology reporter for Wccftech, specializing in the semiconductor industry and the complex interplay between technology, manufacturing, and geopolitics. His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e.g., 2nm process), the economic impact of policies like the CHIPS Act, and the strategic development of AI infrastructure from NVIDIA, AMD and Intel.
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