AMD’s First Exascale APU Rumored To Be Instinct MI300: Powered By Zen 4 CPU Cores & CDNA 3 GPU Cores For Blistering Fast HPC Performance

AMD also seems to be working on its first-generation Exascale APU product, the Instinct MI300, powered by Zen 4 CPU & CDNA 3 GPU cores. The details of this HPC chip have also been leaked over in the latest video by AdoredTV.

AMD Instinct MI300 To Be Red Team's First Exascale APU Product With Zen 4 CPU, CDNA 3 GPU Cores & HBM3 Memory

The first references to AMD's Exascale APU date all the way back to 2013 with more bits and pieces being revealed in the coming year. Back in 2015, the company revealed its plan to offer the EHP, an Exascale Heteorgenous Processor, based on the then-upcoming Zen x86 cores and Greenland GPU with HBM2 memory on a 2.5D interposer. The original plans were eventually scrapped & AMD went on to release its EPYC and Instinct lineup in their own CPU and GPU server segments. Now, AMD is bringing EHP or Exascale APUs back in the form of the next-gen Instinct MI300.

Once again, the AMD Exascale APU will form a harmony between the company's CPU & GPU IPs, combining the latest Zen 4 CPU cores with the latest CDNA 3 GPU cores. This is said to be the first generation Exascale & Instinct APU. In the slide posted by AdoredTV, it is mentioned that the APU will be taped out by the end of this month which means we can see a potential launch in 2023, the same time the company is expected to unveil its CDNA 3 GPU architecture for the HPC segments.

The first silicon is expected to be in AMD's labs by Q3 2022. The platform itself is regarded as MDC which could mean Multi-Die Chip. In a previous report, it was stated that the APU will carry a new 'Exascale APU mode' and feature support on the SH5 socket which is likely coming in the BGA form factor.

Besides the CPU and GPU IPs, another key driver behind the Instinct MI300 APU would be its HBM3 memory support. Though we still aren't sure of the exact number of dies featured on the EHP APU, Moore's Law is Dead has previously revealed die configurations with 2, 4, and 8 HBM3 dies. The die shot is shown in the slide in the latest leak and also shows at least 6 dies which should be a brand new configuration. It is possible that there are several Instinct MI300 configurations being worked upon with some featuring just the CDNA 3 GPU dies and APU designs with both Zen 4 & CDNA3 IPs.

So it looks like we are definitely going to see the Exascale APUs in action after almost a decade of wait. The Instinct MI300 is definitely aiming to revolutionize the HPC space with insane amounts of performance never seen before and with core and packaging technologies that are going to be a revolution for the tech industry. The chip will be competing against NVIDIA's Grace+Hopper Super Chip and Intel's Ponte Vecchio HPC accelerators next year.

AMD Radeon Instinct Accelerators

Accelerator Name	AMD Instinct MI400	AMD Instinct MI350X	AMD Instinct MI300X	AMD Instinct MI300A	AMD Instinct MI250X	AMD Instinct MI250	AMD Instinct MI210	AMD Instinct MI100	AMD Radeon Instinct MI60	AMD Radeon Instinct MI50	AMD Radeon Instinct MI25	AMD Radeon Instinct MI8	AMD Radeon Instinct MI6
CPU Architecture	Zen 5 (Exascale APU)	N/A	N/A	Zen 4 (Exascale APU)	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A
GPU Architecture	CDNA 4	CDNA 3+?	Aqua Vanjaram (CDNA 3)	Aqua Vanjaram (CDNA 3)	Aldebaran (CDNA 2)	Aldebaran (CDNA 2)	Aldebaran (CDNA 2)	Arcturus (CDNA 1)	Vega 20	Vega 20	Vega 10	Fiji XT	Polaris 10
GPU Process Node	4nm	4nm	5nm+6nm	5nm+6nm	6nm	6nm	6nm	7nm FinFET	7nm FinFET	7nm FinFET	14nm FinFET	28nm	14nm FinFET
GPU Chiplets	TBD	TBD	8 (MCM)	8 (MCM)	2 (MCM) 1 (Per Die)	2 (MCM) 1 (Per Die)	2 (MCM) 1 (Per Die)	1 (Monolithic)	1 (Monolithic)	1 (Monolithic)	1 (Monolithic)	1 (Monolithic)	1 (Monolithic)
GPU Cores	TBD	TBD	19,456	14,592	14,080	13,312	6656	7680	4096	3840	4096	4096	2304
GPU Clock Speed	TBD	TBD	2100 MHz	2100 MHz	1700 MHz	1700 MHz	1700 MHz	1500 MHz	1800 MHz	1725 MHz	1500 MHz	1000 MHz	1237 MHz
INT8 Compute	TBD	TBD	2614 TOPS	1961 TOPS	383 TOPs	362 TOPS	181 TOPS	92.3 TOPS	N/A	N/A	N/A	N/A	N/A
FP16 Compute	TBD	TBD	1.3 PFLOPs	980.6 TFLOPs	383 TFLOPs	362 TFLOPs	181 TFLOPs	185 TFLOPs	29.5 TFLOPs	26.5 TFLOPs	24.6 TFLOPs	8.2 TFLOPs	5.7 TFLOPs
FP32 Compute	TBD	TBD	163.4 TFLOPs	122.6 TFLOPs	95.7 TFLOPs	90.5 TFLOPs	45.3 TFLOPs	23.1 TFLOPs	14.7 TFLOPs	13.3 TFLOPs	12.3 TFLOPs	8.2 TFLOPs	5.7 TFLOPs
FP64 Compute	TBD	TBD	81.7 TFLOPs	61.3 TFLOPs	47.9 TFLOPs	45.3 TFLOPs	22.6 TFLOPs	11.5 TFLOPs	7.4 TFLOPs	6.6 TFLOPs	768 GFLOPs	512 GFLOPs	384 GFLOPs
VRAM	TBD	HBM3e	192 GB HBM3	128 GB HBM3	128 GB HBM2e	128 GB HBM2e	64 GB HBM2e	32 GB HBM2	32 GB HBM2	16 GB HBM2	16 GB HBM2	4 GB HBM1	16 GB GDDR5
Infinity Cache	TBD	TBD	256 MB	256 MB	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A
Memory Clock	TBD	TBD	5.2 Gbps	5.2 Gbps	3.2 Gbps	3.2 Gbps	3.2 Gbps	1200 MHz	1000 MHz	1000 MHz	945 MHz	500 MHz	1750 MHz
Memory Bus	TBD	TBD	8192-bit	8192-bit	8192-bit	8192-bit	4096-bit	4096-bit bus	4096-bit bus	4096-bit bus	2048-bit bus	4096-bit bus	256-bit bus
Memory Bandwidth	TBD	TBD	5.3 TB/s	5.3 TB/s	3.2 TB/s	3.2 TB/s	1.6 TB/s	1.23 TB/s	1 TB/s	1 TB/s	484 GB/s	512 GB/s	224 GB/s
Form Factor	TBD	TBD	OAM	APU SH5 Socket	OAM	OAM	Dual Slot Card	Dual Slot, Full Length	Dual Slot, Full Length	Dual Slot, Full Length	Dual Slot, Full Length	Dual Slot, Half Length	Single Slot, Full Length
Cooling	TBD	TBD	Passive Cooling	Passive Cooling	Passive Cooling	Passive Cooling	Passive Cooling	Passive Cooling	Passive Cooling	Passive Cooling	Passive Cooling	Passive Cooling	Passive Cooling
TDP (Max)	TBD	TBD	750W	760W	560W	500W	300W	300W	300W	300W	300W	175W	150W

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