There are currently two 2nm wafer production bases established by TSMC on its home turf that will eventually reach maximum capacity in a few years, allowing the manufacturer to fulfill demand for several customers such as Apple, Qualcomm, MediaTek, and others. After reportedly reaching a 60 percent yield for the trial production run on its 2nm technology, the company is now said to have kicked off a small-scale run of 5,000 monthly wafers at its Baoshan facility. On the subject of progress, a new N2P variant has also launched and will serve as the improved version of the company’s first-generation 2nm process.
The advanced 2nm ‘N2P’ node is said to enter mass production in 2026, with TSMC reportedly eyeing 2025 to successfully commence the manufacturing of the first iteration
In total, TSMC has the Baoshan and Kaohsiung plants, where it continues to reach new production levels to sate the ever-increasing demand for 2nm wafers. According to Economic Daily News, the Taiwanese giant has started a small-scale production on advanced lithography, but its current capacity is limited to 5,000 wafers. However, a previous report stated that the firm had reached 10,000 units during its trial run, with the figure expected to reach 50,000 later this year.
By 2026, that number is estimated to touch 80,000 units, but it is unconfirmed if it is for both the N2 and N2P processes or just one. We have reported that with the Baoshan and Kaohsiung plants operational, TSMC could reach a monthly wafer production output of 40,000 units. In terms of advancement, no other foundry has been able to match the manufacturer’s pace, so it is unsurprising that the majority of firms determined to push out cutting-edge silicon will enlist TSMC’s services.
Perhaps the only apprehension these companies will exhibit is the high wafer price, which is estimated to reach $30,000. While rising costs on the 2nm process would always be a packaged deal, TSMC has been reported to explore new ways to reduce the total bill, starting with a service called ‘CyberShuttle,’ which will kick off in April later this year. The approach will allow companies like Apple, Qualcomm, and others to evaluate their chips on the same test wafer, reducing costs.
It is also possible that if TSMC pushes out a relatively large volume of 2nm wafers, the economies of scale will help balance the cost, leading to the manufacturer’s clients paying a lower sum. However, for that to happen, both Baoshan and Kaohsiung plants must work at 100 percent capacity. As always, we will monitor TSMC’s progress this year and update our readers as follows, so stay tuned.
News Source: Economic Daily News
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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