The 2nm mass production timeline has begun according to schedule, with TSMC previously reported to be experiencing a tight wafer supply due to high demand, which is why the Taiwanese semiconductor behemoth has been reported to plan the construction of three additional plants to keep up with its customers’ demands. As it grapples with this ongoing problem, the company is also reportedly ramping up the construction of its 1.4nm plant, having seemingly achieved better yields with its next-generation lithography. Based on this information, TSMC’s fortune continues to favor it, and at this rate, production of its cutting-edge technology is scheduled to begin in 2027.
The foundation work for TSMC’s 1.4nm plant began in early November, with the new plant location in Central Taiwan Science Park expected to have four factory and office buildings
The initial investment required for the construction of four 1.4nm facilities is NT$1.5 trillion, or $49 billion, and when the plant is finally up and running, with mass production targeted in 2028, TSMC is estimated to witness a revenue surge of $16 billion from all four sites for the first year. On top of that, the company is expected to create between 8,000 and 10,000 jobs. According to the Economic Daily News, foundation work on the Central Taiwan Science Park began in early November, with the tender for the equipment only recently completed, pending the tender for the factory building.
The new plant is expected to house four factory buildings and offices, but there is no mention of which customers intend to leverage the 1.4nm process. Given that Apple has been reported to have secured more than half of TSMC’s initial 2nm production capacity for its A20 and A20 Pro, we would believe that the iPhone maker would want to have a first crack at this technology. However, before the 1.4nm node materializes, TSMC is said to ramp up production for its 1.6nm lithography.
According to a previous report, Apple has yet to enter talks with TSMC to utilize its 1.6nm process, likely leaving NVIDIA as the sole customer for this technology. As for how the company successfully managed to improve yields, which encouraged it to expedite the construction of the new facility, one would assume that it was with the help of ASML’s latest-generation High-NA EUV machinery. However, this equipment costs $400 million apiece, which is not an expense that TSMC is willing to undertake at this time.
The yield figure is currently unknown, but given that we’re in the nascent stages of 1.4nm production, it wouldn’t have been higher than 20 percent. With time, we should see this number rise and with it, a spike in demand, just like TSMC is experiencing with its 2nm process.
News Source: Economic Daily News
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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