TSMC’s Arizona Plant Is Sending Engineers In Batches To Taiwan For 3nm & 2nm Production Training, As These Individuals Prepare Themselves For Pilot Manufacturing In 2028

Dec 6, 2025 at 04:13am EST
TSMC Arizona is sending engineers to Taiwan for 3nm and 2nm production training

The heart of advanced chip production is in Taiwan, where two of TSMC’s plants are reportedly completely booked as the manufacturer aims to reach 100,000 monthly wafers by the end of 2026. Seeing as how the region is the forefront for next-generation lithography, the Arizona plant in the U.S. that has employed hundreds of engineers cannot progress without additional training. According to a new report, these individuals are being sent overseas to learn the ins and outs of 3nm and 2nm production, which will later give the Arizona plant a significant edge in securing chip orders.

In 2021, the U.S. had previously sent engineers to Taiwan for a year and a half for training purposes

Currently, the U.S. plant is focused on 5nm and 4nm production, and will eventually gravitate to the more advanced lithography after its engineers obtain some much-needed experience. Now, as reported by Liberty Times Net, several employees will make their way to Taiwan to better familiarize themselves with 3nm and 2nm technologies. TSMC’s second plant in Arizona has begun construction, meaning that the trip to Taiwan could not have happened at a more opportune moment.

Related Story Apple’s A21 Pro May Exclusively Use TSMC’s Improved 2nm ‘N2P’ Process While Keeping The Standard Version On The Older Node

The aforementioned facility is not expected to begin 3nm production until the third quarter of 2027, with the 2nm and A16 processes aimed for trial production sometime in 2028. Demand for both 3nm and 2nm wafers has skyrocketed, with JPMorgan analysts commenting that 3nm capacity will reach its limit by 2026, with TSMC reportedly planning to build three more 2nm plants on its home turf to fulfill orders, with the initial investment said to reach a whopping $28.6 billion.

TSMC is also rushing to bring advanced packaging to the U.S., with the technology said to arrive in 2027. Apple, which has been the Taiwanese semiconductor behemoth’s most lucrative customer for years, has reportedly secured more than half of the initial 2nm batch for its A20 and A20 Pro, with NVIDIA said to exclusively utilize the A16 node for its upcoming GPUs.

About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.

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