60%
Plausible
The biggest hindrance to smartphone chipsets unlocking their potential is heat dissipation, and while TSMC’s 2nm process is expected to introduce some efficiency improvements, the ever-growing complexity and size of these SoCs mean that newer packaging needs to be adopted to break through the performance ceiling. One tipster notes that the industry has been discussing companies like TSMC and Huawei exploring 3D packaging for the smartphone category, but the reality is that this technology offers far too many drawbacks for it to be adopted for this specific sector. Instead, these firms appear to focus solely on improving manufacturing processes.
Apple could be the first to adopt 3D packaging for its portable products, given that its M5 Pro and M5 Max are expected to utilize TSMC’s 2.5D technology
Unlike servers or desktop processors like AMD’s Ryzen 7 9800X3D that are aided by beefy cooling solutions, smartphone chipsets barely have sufficient room to transfer heat effectively, only relying on vapor chambers (and sometimes miniature fans) to get the job done. For those who don’t know, 3D packaging involves stacking individual chips on top of one another, creating a sandwich that generates immense heat that cannot escape properly because the bottom layers have blocked that path.
Only recently, Samsung introduced its Heat Pass Block (HPB) solution on the Exynos 2600, an approach that stacks a copper heatsink on top of the silicon die to help reduce temperatures. Sadly, that’s not effective for 3D packaging because of the reasons mentioned above. On Weibo, Fixed-focus digital cameras have commented that, despite industry whispers about TSMC and Huawei switching to this packaging, these companies will remain focused on improving manufacturing processes.
Also, there’s an even bigger obstacle standing in the way of companies that believe that improving nodes will capture the mass market’s attention. According to an earlier report, cutting-edge fabrication is no longer influencing consumer interest, leaving Apple, Qualcomm, and MediaTek to make adjustments such as bringing architectural improvements. However, if there were ever a company that could potentially adopt 3D packaging, it would be Apple, though the technology would likely remain limited to its M-series of SoCs and not branch out to the A-series family of silicon because of, you guessed it, the thermal trade-offs.
Since the M5 Pro and M5 Max are expected to utilize the 2.5D packaging instead of InFO (Integrated Fan-Out), the Cupertino firm could explore 3D technology. Then again, we don’t advise getting your hopes up. Since this is the first time that Apple is bringing 2.5D packaging to the M5 Pro and M5 Max, it will likely take years for the transition to happen. In short, smartphone chipsets will probably be stuck with the traditional packaging, but that doesn’t mean companies won’t be aggressively searching for solutions that can allow them to explore other opportunities, even if it’s not 3D packaging.
News Source: Fixed-focus digital cameras
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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