Press Release

Two UberNovo office chairs, one viewed from the back and the other from the front, under soft lighting beside a desk.

Two UberNovo office chairs, one viewed from the back and the other from the front, under soft lighting beside a desk.

LiberNovo North American Pre-Sales Now Live with the First Dynamic Ergonomic Chair

NVIDIA’s RTX PRO 6000 Blackwell ‘Server’ Edition GPU Expected to Launch in New 2U Configuration Later This Year, Offered by Major Server Providers

Tronsmart’s Fiitune X30: Next-Generation Home Speaker with Spatial Audio in High Fidelity

MSI AGESA 1.2.0.3e BIOS

MSI Officially Rolls Out AMD AGESA 1.2.0.3e BIOS, Supporting 64GB x4 DRAM Configuration And “New” Ryzen CPU

NVIDIA to Develop a “Mega AI Factory” In Taiwan With Foxconn, Will Feature Up To 10,000 Blackwell GPUs

AMD Releases EPYC 4005 Series Workstation CPUs, Featuring Up To 16 Zen 5 Cores With Impressive Performance Figures

Power Up the Teyvat Journey: UGREEN Launches Genshin Impact Co-Branded Charging Collection

AMD Announces Complete Acquisition of ZT Systems, Attempting To Combat Against NVIDIA’s Influence Over The AI/DC Markets

Micron Introduces 12-High HBM3E And LPDDR5X-Based SOCAMM For NVIDIA’s High Performance Chips

Biwin Debuts New OC Lab Gold Edition DW100 192 GB DDR5 Memory Kit, Offering Up To 6400 MT/s Speed At CL30 1

Biwin Debuts New OC Lab Gold Edition DW100 192 GB DDR5 Memory Kit, Offering Up To 6400 MT/s Speed At CL30

Intel Xeon 6 CPU

Intel Announces Leadership With Xeon 6 “Granite Rapids CPUs” In Network Infrastructure; Sees Adoption From Mainstream Telecom Operators

PowerColor Intros Radeon RX 9070 XT & RX 9070 GPUs: Red Devil, Hellhound, And Reaper Series 1

PowerColor Intros Radeon RX 9070 XT & RX 9070 GPUs: Red Devil, Hellhound, And Reaper Series

Micron Ships Out Industry’s First 1γ DRAM Node, Targeted Towards Taking DDR5 Capabilities To New Levels

Biwin Launches First DDR5 RGB Memory Kit With Dual EXPO Profiles: 8000 CL34 & 6400 CL28 Configs 1

Biwin Launches First DDR5 RGB Memory Kit With Dual EXPO Profiles: 8000 CL34 & 6400 CL28 Configs

BLUETTI Unveils Apex 300 and EnergyPro 6K, Highlighting Brand Refinement Strategy for 2025

Montage Technology Unveils 2nd-Generation MRCD & MDB Chipsets, Designed For Fueling Performance Of DDR5 MRDIMM Memory Modules

INNOCN Showcases One Of Industry’s Largest 5K2K OLED Gaming Monitor; Featuring A Gigantic 49-Inch Curved Display

NVIDIA Enhances Google’s Quantum AI Processor Designs Through Simulations On Specialized CUDA-Q Platform

MSI Intros Cutting-Edge MEG VISION X AI 2nd Gen Gaming Desktop; Featuring NVIDIA’s RTX 50 Series GPUs & Intel’s Core Ultra Series 2 CPUs

MSI Unveils “Next-Gen Ready” MEG Ai1600T PCIE5 & MPG A1250GS PCIE5 Power Supplies, Offering ATX 3.1, PCIe 5.1 & 12v-2×6 Support

LG Showcases “World’s First” 5K2K Bendable Gaming Monitor, Taking Premiumness To New Levels

Frore Systems Manages To Bring In Up To A 50% Performance Bump In Samsung’s Galaxy Book4 Edge Laptop Using AirJet Cooling Chips

Frore Systems Unveils “AirJet” Cooling Solution For NVIDIA’s Newest Jetson Orin Nano Super AI “Mini-Supercomputer”

NVIDIA’s CEO Jensen Huang To Deliver Iconic “CES 2025” Keynote On January 6, Reshaping The Future of Computing Industries

Intel Foundry Unveils "Innovative" Strategies For Transistors & Packaging Technologies, Enhancing Silicon Scalability

Intel Foundry Unveils “Innovative” Strategies For Transistors & Packaging Technologies, Enhancing Silicon Scalability

Intel Secures Around $8 Billion In New CHIPS Act Grants, Potentially Leading To a Financial Revival 1

Intel Secures Around $8 Billion In New CHIPS Act Grants, Potentially Leading To a Financial Revival

TEAMGROUP Unveils T-Force GA PRO PCIe Gen 5.0 SSD: Speeds Up To 10,000 MB/s & Graphene Heatsink

AMD Showcases Next-Gen Versal Prime Series "Gen 2" Adaptive SoCs, Feature CXL 3.1, PCIe Gen 6.0 & LPDDR5X 1

AMD Showcases Next-Gen Versal Prime Series “Gen 2” Adaptive SoCs, Feature CXL 3.1, PCIe Gen 6.0 & LPDDR5X

Solidigm Unveils World's First "122 TB" Data Center SSD, Targeting AI-Focused Workloads 1

Solidigm Unveils World’s First “122 TB” Data Center SSD, Targeting AI-Focused Workloads

New for Mobile Gamers: AUKEY MagFusion GameFrost Cooling Wireless Charger – Available Now

GeIL To Launch Next-Gen CUDIMM DDR5 Memory Modules, Up To 9200 MT/s

Samsung Releases New Technology To Compete With TSMC Chip Orders From Apple

Global Semiconductor Sales Witnesses A Massive Quarterly Rise, Recording $166 Billion In Revenue

G.SKILL Unveils Trident Z CK DDR5 CUDIMM Modules, Up To 9600 MT/s Speeds For Core Ultra CPUs

Rambus Showcases Industry's First DDR5 MRDIMMs & RDIMMs Memory Modules, Speeds Up To 12,800 MT/s 1

Rambus Showcases Industry’s First DDR5 MRDIMMs & RDIMMs Memory Modules, Speeds Up To 12,800 MT/s

Intel & AMD Join Hands To Accelerate Development of "x86 Ecosystem", Ramping Up Market Competition 1

Intel & AMD Join Hands To Accelerate Development of A Unified x86 Ecosystem, Ramping Up Market Competition

Load More