Tensor G4 For The Pixel 9, Pixel 9 Pro To Reportedly Adopt FOWLP Technology, Just Like Samsung’s Exynos 2400

Omar Sohail
Tensor G4 to reportedly adopt FOWLP technology like the Exynos 2400

The Tensor G4 will likely be powering the Pixel 9 and Pixel 9 Pro later this year, and while Google’s chipsets have historically delivered poorer performance and efficiency metrics compared to the competition, the upcoming chipset is rumored to receive a few upgrades. Going on the path of the Exynos 2400, a new report says that the Tensor G4 will be treated to FOWLP or ‘Fan out Wafer Level Packaging.’ While we have discussed the advantages of using this technology, let us inform readers who are hearing about it for the first time as its benefits might compel them to upgrade to the Pixel 9 or Pixel 9 Pro later this year.

Google also reportedly leveraging Samsung’s newer 4nm process for the Tensor G4, making it significantly more capable than the Tensor G3

The information from Korean media outlet FNN was spotted by tipster Revegnus, who provided a summary on X. Like the Exynos 2400, the Tensor G4 is said to be mass produced on Samsung’s 4nm process. However, the report did not mention which 4nm variation Google would adopt for the upcoming silicon, so we assume that it will be the 4LPP+ node. As for FOWLP, it is a welcome addition to help the Tensor G4 maintain its temperatures within the recommended threshold for more extended periods.

Related Story A Pixel 9 Pro Is Being Kept “Hostage” By Google After Its Automated Repair Diagnostic Incorrectly Charged An Owner $490 For A Non-Existent Problem

After witnessing Pixel 8 and Pixel 8 Pro thermal throttled when running the regular version of 3DMark’s Wild Life test and not the extreme version, it is evident that Google would have to make some extreme implementations to improve the successor. FOWLP technology employs more I/O connections for those who do not know, so electrical signals can pass through the chipset faster and more efficiently. This type of packaging also helps in heat resistance, allowing its SoC to maintain higher levels of multi-core performance since its temperature can be controlled.

Samsung states on its Exynos 2400 product page that this technology allows it to deliver an 8 percent improvement in multi-core performance and may also explain why the SoC performed exceptionally in 3DMark’s Wild Life Extreme compared to Samsung’s previous chipset releases. Assuming the Tensor G4 adopts this technology, we may see similar results. It was high time that the advertising giant did something to combat the inefficient nature of its chipset range, and now, we might finally get to see that in the Pixel 9 and Pixel 9 Pro.

If you want to learn more about the Tensor G4, we have an extensive rumor roundup that discusses whatever rumors and reports have come out in the past, so remember to check it out, as it contains vital information that will be highly useful when making an informed purchasing decision in the future.

News Source: FNN

Omar Sohail Photo

About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.

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