A new generation of SK Hynix DDR5 memory has surfaced online, which is reportedly identified by the "X021" marking and a new "AKBD" part code.
Second Gen 3Gb A-Die Memory Spotted on Facebook; May Feature Native JEDEC Speed of 7200 MT/s
The latest SK Hynix DDR5 memory chip may be around the corner, as we just saw one being posted on the Facebook group "Clock'EM UP by Team Group's Kevin Wu. The chip is seen labeled with the marking X021 and the part code "AKBD". As per @unikoshardware, the X021 label indicates second-generation 3Gb A-die, which will succeed the 3Gb M-die variant, which is powering early DDR5 modules.
Keep in mind that SK Hynix hasn't made any official announcement regarding the new 3Gb DDR5 A-Die, but the posted pic gives us some clues regarding the upcoming chip. We know from HK Hynix's naming convention that letter pairs such as EB, GB, and HB have corresponded to 4800, 5600, and 6400 MT/s JEDEC speeds, respectively. Therefore, the new "KB" designation likely continues this pattern and points to the 7200 MT/s speed, which Kevin has confirmed in a reply as well.
That said, this aligns with Intel's future platform roadmap, considering that the Arrow Lake Refresh and Panther Lake CPUs are expected to support 7200 MT/s DDR5 speed under Intel's Plan of Record. This is a significant uplift from Raptor Lake's DDR5-5600 and Arrow Lake's DDR5-6400 standards. That means the new A-Die chips could become the foundation for the next-gen high-frequency memory kits for upcoming Intel processors.
Still, one user points out that since this module appears to use an 8-layer PCB, it can affect the stability at high memory speeds. SK Hynix looks to have produced early/initial samples like these, but to sustain high memory speeds, 8-layer PCBs struggle to maintain speeds over 8000 MT/s, despite featuring the newer A-Die ICs. So, the limiting factor isn't necessarily the chip itself, but the signal integrity and power delivery restraints of lower-layer PCBs.
Higher-end DDR5 RAM kits often use 10-layer PCBs or sometimes even 12-layer PCBs to achieve higher memory speeds due to cleaner signal paths. We have already seen many enthusiasts breaking the 12,000 MT/s mark, and have even officially surpassed the 13,000 MT/s mark recently. So, memory makers will need to deploy the 10-layer/12-layer PCBs with the new A-Die "AKBD" chips to actually benefit from the latest silicon.
| Specification | Details |
|---|---|
| Die Type | SK Hynix 3Gb A-Die (2nd gen) |
| Marking | X021 |
| Part Code | AKBD |
| Native Speed (Speculated) | 7200 MT/s (JEDEC) |
| Platform | Arrow Lake Refresh, Panther Lake |
About the author: Sarfraz Khan is a hardware reporter with a focus on PC components and the builder community. With years of experience writing about PC hardware and laptops, his work has been featured on several reputable technology publications. Sarfraz's hands-on experience is demonstrated through his first-person accounts of using and comparing different hardware configurations, providing practical and relatable insights for everyday users. His technical analysis is respected by peers in the enthusiast community and has been cited by specialized hardware sites such as Germany's Igor's Lab.
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