The 3nm GAA process is a memory that Samsung wishes it could erase from this timeline, but the company has seemingly defied all odds and managed to materialize the Exynos 2500, with the Korean giant putting up the newest details of its flagship chipset that will reportedly power the upcoming Galaxy Z Flip 7. Like the Exynos 2400, the new SoC will utilize a 10-core CPU cluster while also sporting Samsung’s improved FOWLP (fan-out wafer-level packaging), along with other upgrades. Here is more information that you would love to check out.
On the specifications page, the Exynos 2500’s ‘Product Status’ is mentioned as ‘Mass production,’ but due to lower yields, the chipset may be produced in fewer quantities
Interestingly, regarding the CPU configuration, Samsung mentions that the Exynos 2500 features a Cortex-X5 core, though it is officially called the Cortex-X925 and runs at 3.30GHz. The remaining cluster includes two Cortex-A725 cores operating at 2.74GHz, five Cortex-A725 running at 2.36GHz, and two Cortex-A520 functioning at 1.80GHz. Unfortunately, if you believe these specifications will challenge the Dimensity 9400, Snapdragon 8 Elite, or Apple’s A18 and A18 Pro, we must be the bearer of terrible news.
In a previous Geekbench 6 leak, the Exynos 2500 disappoints in both the single-core and multi-core scores, but we are willing to give the chipset the benefit of the doubt and wait for the Galaxy Z Flip 7 to be taken through the same benchmark. Alongside the 10-core cluster, the Exynos 2500 is paired with an Xclipse 950 GPU, support for LPDDR5X RAM, UFS 4.0 storage, and an AI engine whose NPU can deliver up to 59 trillion TOPS, making it 39 percent faster than the Exynos 2400’s.
Overall, Samsung claims that the chipset’s big-core performance improves by 15 percent, with ray tracing support possible thanks to AMD’s RDNA3 architecture, delivering console-like graphics from a mobile device. Additionally, the Exynos 2500 adopts the newer fan-out wafer-level packaging, bringing better efficiency and increased heat dissipation. The Galaxy Z Flip 7 is not confirmed to feature a vapor chamber, but assuming that it does, Samsung’s latest 3nm GAA SoC can benefit from the added cooling solution.
“Increase your productivity while using less power. The Exynos 2500 brings you enhanced power efficiency enabled by improvements in the power reduction architecture across various blocks, as well as the latest manufacturing processes and packaging technology. Built with the cutting-edge 3nm Gate All Around (GAA) process technology, the Exynos 2500 provides better power efficiency and enhanced heat dissipation at a much reduced chip thickness through fan-out wafer-level packaging (FOWLP). Plus, further optimization has been achieved through the aforementioned modifications to CPU core structure and implementation of an analog GNSS interface.”
Other specifications include a 320MP primary camera and 8K 30FPS video recording. As for wireless connectivity, the Exynos 2500 supports Bluetooth 5.4, Wi-Fi 7, and a 5G modem with downlink speeds of 9.6Gbps for FR1 and 12.1Gbps for FR2. Samsung is scheduled to announce the Galaxy Z Flip 7 at its Galaxy Unpacked event happening next month. During that time, we shall learn more about the Exynos 2500, so stay tuned for further updates.
News Source: Samsung
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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