It's rumored that the change in the application of the liquid metal and thermal paste on the Matrix RTX 5090 had ASUS pull back the GPUs from the market initially.
Der8auer Shows ASUS Quietly Changed the Thermal Paste/Liquid Metal Application on the ROG Matrix RTX 5090, Pointing Towards the Recent "Quality" Issue Rumor
A few weeks ago, we heard that ASUS reportedly pulled back all the ROG Matrix RTX 5090 Limited Edition cards due to an unknown "quality" issue (no, it's not the misaligned connector). While ASUS refuted such claims, the latest investigation by popular overclocker Der8auer reveals what might be the real reason for recalling a thousand cards to fix the issue. Apparently, it doesn't seem like a major "quality" issue and has more to do with how the thermal compound has been applied to the GPU's substrate.
Keep in mind, this is just a speculation, but it could be true, considering that what Der8auer saw on a newly bought ROG Matrix RTX 5090 GPU was totally different from what his previous review sample. If you have watched his first ROG Matrix RTX 5090 teardown, you will see that the GPU substrate uses liquid metal, along with thermal paste applied to the circumference. However, the new unit has a different approach to how these were applied.
While the liquid metal is concentrated on the GPU IHS, it's now blocked from seeping out from the GPU chip by a layer of thermal paste. Then there is a small opening on the right, followed by two more vertical lines of thermal paste that leave clearance on both sides for some breathing, which Der8auer calls much more professional. The final square-shaped or double-U thermal paste application follows these vertical lines, which also have an opening on both sides.
Last time, the liquid metal easily got scattered outside of the IHS, which proved the previous application to be inefficient. However, this time the liquid metal is in its original place, ensuring better heat dissipation from the GPU chip to the heatsink. We don't know if this is how all the ROG Matrix RTX 5090 units are made, but if the report of recalling all the units was true, ASUS might have changed the thermal compound application of all the cards to ensure better thermal performance.
As per FurMark testing, the new card was pulling nearly 800W, and both the 12V-2x6 and ASUS HPWR connectors were pulling almost 350-450W of power each, ensuring the connector can run cooler. The GPU temperature hit nearly 70-72°C under full load, which shows a slight improvement vs the previous sample. Previously, it was tested on Speed Way with around 700W of power consumption, and the temperature remained in the 67-69°C range. This isn't a direct comparison, but overall, the GPU now seems to be performing slightly better thermally.
About the author: Sarfraz Khan is a hardware reporter with a focus on PC components and the builder community. With years of experience writing about PC hardware and laptops, his work has been featured on several reputable technology publications. Sarfraz's hands-on experience is demonstrated through his first-person accounts of using and comparing different hardware configurations, providing practical and relatable insights for everyday users. His technical analysis is respected by peers in the enthusiast community and has been cited by specialized hardware sites such as Germany's Igor's Lab.
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