Intel Core i9-14900K / Intel Core i7-14700K / Intel Core i5-14600K
October 2023Type
CPUsPrice
$589 / $409 / $319Intel Z790 Chipset - Top 700-Series PCH
Intel's Raptor Lake-S desktop CPU platform features support on the LGA 1700 socket which is also used by the Alder Lake CPUs. You can find various motherboards under the 700 & 600 series that support the latest chips. There are refreshed designs with which you don't require a BIOS upgrade to support 14th Gen chips such as the Aorus Master X and then there are older designs that also support the chips but require a BIOS upgrade.
Another interesting thing to talk about the Z790 PCH is its process node and dimensions. The Z790 PCH is based on the 14nm node and measures at 98mm2 which is slightly larger than the Z590 PCH featured on LGA 1200 socket motherboards.
Intel Desktop Platform Chipset Comparison
| Chipset Name | Arrow Lake-S (ARL-S) PCH / 800 Series (Z890) | Raptor Lake-S (RPL-S) PCH / 700 Series (Z790) | Alder Lake-S (ADL-S) PCH / 600 Series (Z690) | Rocket Lake-S (RKL-S) PCH / 500 Series (Z590) | Comet Lake-S (CML-S) PCH / 400 Series (Z490) | Coffee Lake S (CFL-S) PCH / 300 Series (Z390/H370, B360, Q370, H310) | Coffee Lake S (KBL-R) PCH / Z370 Platform |
|---|---|---|---|---|---|---|---|
| Process Node | 7nm | 14nm | 14nm | 14nm | 14nm | 14nm | 22nm |
| Processor | 24C, 20C, 14C, 12C, TBD) | 24,16C,12C,10C,6C,4C | 16C,12C,10C,6C,4C (Full corporate/consumer SKU stack at launch) | 8C, 6C (Full corporate/consumer SKU stack at launch) | 10C, 8C, 6C, 4C, 2C (Full corporate/consumer SKU stack at launch) | 8C, 6C, 4C, 2C (Full corporate/consumer SKU stack at launch) | 8C, 6C, 4C (6 Consumer SKUs at Launch) |
| Memory | Up To DDR5-6400 (Native) | Up To DDR5-5600 (Native) Up To DDR4-3200 (Native) | Up To DDR5-4800 (Native) Up To DDR4-3200 (Native) | Up To DDR4-3200 (Native) | Up To DDR4-2933 (Native) | Up To DDR4-2666 (Native) | Up To DDR4-2666 (Native) |
| Media, Display & Audio | eDP / 4DDI (DP, HDMI) Display Capabilities | eDP / 4DDI (DP, HDMI) Display Capabilities | eDP / 4DDI (DP, HDMI) Display Capabilities | DP 1.2 & HDMI 2.0, HBR3 HDCP 2.2 (HDMI 2.0a w/LSPCON) 12-bit AV1/HEVC & VP9 10-bit Enc/Dec, HDR, Rec.2020, DX12 Integrated Dual-Core Audio DSP With USB Audio offload SoundWire Digital Audio Interface | DP 1.2 & HDMI 1.4 HDCP 2.2 (HDMI 2.0a w/LSPCON) HEVC & VP9 10-bit Enc/Dec, HDR, Rec.2020, DX12 Integrated Dual-Core Audio DSP SoundWire Digital Audio Interface | DP 1.2 & HDMI 1.4 HDCP 2.2 (HDMI 2.0a w/LSPCON) HEVC & VP9 10-bit Enc/Dec, HDR, Rec.2020, DX12 Integrated Dual-Core Audio DSP SoundWire Digital Audio Interface | DP 1.2 & HDMI 1.4 HDCP 2.2 (HDMI 2.0a w/LSPCON) HEVC & VP9 10-bit Enc/Dec, HDR, Rec.2020, DX12 Integrated Dual-Core Audio DSP |
| I/O & Connectivity | Integrated USB 3.2 Gen 2x2 (20G) Integrated Intel Wireless-AC (Wi-Fi6E/ 7 BT CNVio) with Gig+ Integrated SDXC 4.0 Controller Thunderbolt 4.0 | Integrated USB 3.2 Gen 2x2 (20G) Integrated Intel Wireless-AC (Wi-Fi6E/ 7 BT CNVio) with Gig+ Integrated SDXC 4.0 Controller Thunderbolt 4.0 | Integrated USB 3.2 Gen 2x2 (20G) Integrated Intel Wireless-AC (Wi-Fi6E/ 7 BT CNVio) with Gig+ Integrated SDXC 4.0 Controller Thunderbolt 4.0 | Integrated USB 3.2 Gen 2x2 (20G) Integrated Intel Wireless-AC (Wi-Fi6E/ BT CNVi) Integrated SDXC 3.0 Controller Thunderbolt 4.0 (Maple Ridge) | Integrated USB 3.2 Gen 2 Integrated Intel Wireless-AC (Wi-Fi / BT CNVi) Integrated SDXC 3.0 Controller Thunderbolt 3.0 (Titan Ridge) w/ DP 1.4 | Integrated USB 3.1 Gen 1 (5 Gbps) Integrated Intel Wireless-AC (Wi-Fi / BT CNVi) Integrated SDXC 3.0 Controller Thunderbolt 3.0 (Titan Ridge) w/ DP 1.4 | Integrated USB 3.1 Gen 1 (5 Gbps) Thunderbolt 3.0 (Alpine Ridge) |
| Storage | PCIe 5.0 (CPU Lanes), 8x SATA 3.0 | Next-Gen Intel Optane memory PCIe 5.0 (CPU Lanes), 6x SATA 3.0 | Next-Gen Intel Optane memory PCIe 5.0, 6x SATA 3.0 | Next-Gen Intel Optane memory PCIe 4.0, 6x SATA 3.0 | Next-Gen Intel Optane memory PCIe 3.0, 6x SATA 3.0 | Next Gen Intel Optane memory PCIe 3.0, 6x SATA 3.0 | Next Gen Intel Optane memory PCIe 3.0, 6x SATA 3.0 |
| Max PCH PCIe Lanes | Up To 24 (Gen 4) | Up To 20 (Gen 4) Up To 8 (Gen 3) | Up To 12 (Gen 4) Up To 16 (Gen 3) | Up To 24 (Gen 3) | Up To 24 (Gen 3) | Up To 24 (Gen 3) | Up To 24 (Gen 3) |
| Max CPU PCIe Lanes | Up To 20 (Gen 5) Up To 4 (Gen 4) | Up To 16 (Gen 5) Up To 4 (Gen 4) | Up To 16 (Gen 5) Up To 4 (Gen 4) | Up To 20 (Gen 4) | Up To 16 (Gen 3) | Up To 16 (Gen 3) | Up To 16 (Gen 3) |
| Max USB Ports | Up To 5 (USB 3.2 Gen 2z2) Up To 10 (USB 3.2 Gen 2x1) Up To 10 (USB 3.2 Gen 1x1) Up To 14 (USB 2.0) | Up To 5 (USB 3.2 Gen 2x2) Up To 10 (USB 3.2 Gen 2x1) Up To 10 (USB 3.2 Gen 1x1) Up To 14 (USB 2.0) | Up To 4 (USB 3.2 Gen 2x2) Up To 10 (USB 3.2 Gen 2x1) Up To 10 (USB 3.2 Gen 1x1) Up To 14 (USB 2.0) | Up To 3 (USB 3.2 Gen 2x2) Up To 10 (USB 3.2 Gen 2x1) Up To 10 (USB 3.2 Gen 1x1) Up To 14 (USB 2.0) | Up To 10 (USB 3.2) Up To 14 (USB 2.0) | Up To 10 (USB 3.1) Up To 14 (USB 2.0) | Up To 10 (USB 3.0) Up To 14 (USB 2.0) |
| Security | Intel TET Intel Boot Guard | N/A | N/A | N/A | Intel SGX 1.0 | Intel SGX 1.0 | Intel SGX 1.0 |
| Power Management | C10 & S0ix Support for Modern Standby | C10 & S0ix Support for Modern Standby | C10 & S0ix Support for Modern Standby | C10 & S0ix Support for Modern Standby | C10 & S0ix Support for Modern Standby | C10 & S0ix Support for Modern Standby | C8 Support |
| Launch | 2024 | 2022 | 2021 | 2021 | 2019 | 2018 | 2017 |
LGA 1700 Socket - 14th, 13th & 12th Generation CPU Support
The Intel 14th Gen CPUs are the last desktop family to hit the LGA 1700 socket. The socket adds more pins to the socket and changes the dimensions entirely. The LGA 1700 socket offers 500 more pin connections to the CPU, allowing for more communication channels with the board itself and accommodating electrical pin configurations that are required to support 14th, 13th & 12th Gen CPUs.
Contents
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About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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