The Intel Comet Lake processors feature higher clock speeds and more cores, this means that the temperatures can directly be affected by the updated design. In terms of packaging, the CPUs ship with the same STIM or Soldered Thermal Interface Material as the 9th Gen Unlocked chips.
In short, Intel has gone back to the soldered design with higher quality thermal interface material between the die and IHS so that should technically lead to better temperatures under overclocking and stress situations. The results were carried out with the ASUS Ryujin 240 AIO liquid cooler:
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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