Google’s Pixel 9 and Pixel 9 Pro will not only receive notable design changes, as seen thanks to a previously leaked render gallery, but it is reported that two meaningful upgrades will arrive for the two models. According to the latest report, one is a new 5G modem, while the other is satellite connectivity, a feature Apple introduced with the iPhone 14 series in 2022.
A new Exynos 5400 5G modem is said to arrive to the Pixel 9 and Pixel 9 Pro; satellite connectivity will be focused on two-way messaging
Since switching to its semi-custom Tensor chipsets in 2021, Google’s Pixel lineup has witnessed its fair share of modem issues. Fortunately, those problems might be a thing of the past, with Android Authority reporting that the Pixel 9 and Pixel 9 Pro will tout Samsung’s Exynos 5400 5G modem. Though the exact specifications were not given, this baseband chip is expected to deliver faster performance while consuming less power than the Exynos 5300 found inside previous-generation Pixel models.
The software stack is said to be upgraded, which should improve stability. Most importantly, the Exynos 5400 will support 3GPP Release 17, which allows for 5G non-terrestrial networks (NTN) or, in other words, satellite-based communication. Google is said to be hard at work implementing a ‘Satellite SOS’ feature for Pixel handsets, and all of this functionality will be possible thanks to the company’s partnership with T-Mobile, which has collaborated with SpaceX to introduce the infrastructure.
With satellite connectivity supported by the Pixel 9 and Pixel 9 Pro, the link will support text-based communication, not calls. However, a special ‘Satellite Gateway’ app will allow for easy communications with emergency services through a feature called ‘Emergency SOS.’ We believe this addition will be triggered when Pixel 9 or Pixel 9 Pro owners have been stranded or are in a life-threatening situation. Unlike other Google projects, we hope the company does not pull the plug on this since it can greatly save lives.
Another upgrade not mentioned in the report was that the Pixel 9 and Pixel 9 Pro will feature Google’s Tensor G4 chipset. Previously, it was reported that this SoC would be a minor upgrade over the Tensor G3, but we have learned that the new silicon will be made using FOWLP or ‘Fan out Wafer Level Packaging.’ For those who do not know, this is the same technology used for Samsung’s Exynos 2400, and it employs more I/O connections so electrical signals can pass through the chipset faster and more efficiently.
This packaging also aids in heat resistance, allowing the Tensor G4 to maintain higher levels of multi-core performance since its temperature can be controlled. Considering the multiple overheating reports surrounding the Tensor G3, this will be seen as a welcome change to the Tensor G4 and may even be one of the primary reasons why the Pixel 9 and Pixel 9 Pro witness an influx of sales.
News Source: Android Authority
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