NVIDIA's next-gen Rubin architecture is expected to come out from TSMC's fabs as soon as Q4 2025, which means a new lineup has dropped in just six months from the previous one.
NVIDIA’s Rubin AI Architecture Claimed To Be a Ground-Up Redesign, Promising Major Performance Improvements
When you look at Team Green's product cycle, the firm is currently unmatched mainly since the company has just ramped up Blackwell Ultra GB300 server production, and now, we are already talking about the transition to a newer architecture. NVIDIA's CEO Jensen Huang recently revealed that six different Rubin chips are currently being taped out at TSMC, and now, according to the analyst @dnystedt, it is being reported that fully functional Rubin chips could come out from TSMC's fabs as soon as year-end, ready for customer deployment.
This is simply top-tier stuff from NVIDIA, considering that Rubin is claimed to be one of the firm's most advanced architectures, integrating components and elements that are entirely newer standards for the industry. The Vera Rubin platform, which is both the newer CPU and the GPU, is claimed to feature TSMC's N3P process along with CoWoS-L packaging. More importantly, it will be Team Green's transition towards chiplet-based designs for its AI architecture, which will likely put the firm on par with any competition coming from AMD.
Rubin's I/O die is claimed to feature TSMC's N5B (5nm) process, and will also have 12-Hi HBM4 chips attached through the CoWoS-L packaging. The Vera CPUs will feature both TSMC N3P and N3B, and will be the first NVIDIA-ARM CPU to feature a chiplet design as well, which is why we say that Rubin will come with advancements from the ground up and in every department. The demand is projected to be similar to what NVIDIA saw when it transitioned from Ampere to Hopper, and given the improvements with Vera Rubin, we should expect huge stuff for Team Green.
NVIDIA recently reported its Q2 earnings, and Jensen Huang claimed that the AI compute markets are scaling up to be a $3 trillion to $4 trillion segment. Judging by his estimates, Rubin will play a vital role. Interestingly, TSMC is going to be busier than ever taping out Rubin chips since the Taiwan giant is handling every element from semiconductors to packaging. The future is bright for NVIDIA's AI frenzy, which is expected to be boosted by the Vera Rubin platform.
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