The first 2nm chips are not expected until next year, with MediaTek reportedly sticking with TSMC’s third-generation 3nm process for its Dimensity 9500 release later this year. However, the Taiwanese fabless semiconductor manufacturer wanted to make a statement that it has no intentions of slowing down in becoming the global leading chipset provider by announcing that it will commence the tape-out of its 2nm silicon in the fourth quarter of 2025.
What is interesting about this statement is that the company is not scheduled to unveil its first product on the cutting-edge lithography until late 2026. Fortunately, initiating the tape-out in Q4 means that it will have more time on its hands to make certain tweaks and also have a sufficient quantity available for a number of customers.
A comparison slide shows that MediaTek’s tentative Dimensity 9600 will deliver up to a 25 percent efficiency improvement over the previous-generation releases
The tape-out process for MediaTek’s 2nm chips will start in September. For those unfamiliar with the term, it is the final stage of a silicon’s design, after which it is sent to the manufacturer, which in this case would be TSMC, to kick off mass production. From start to finish, the entire process costs millions, and assuming that the chip does not perform according to MediaTek’s expectations, it has to be sent back for another tape-out run.
During an announcement, a MediaTek executive stated that the tape-out of 2nm chipsets would start in September, and with TSMC already reported to accept orders on its next-generation lithography from April 1, a headset start is always advantageous. For instance, MediaTek can make certain tweaks that can enable its unnamed chipset to deliver the same performance and efficiency attributes as the Snapdragon 8 Elite Gen 2.
The 2nm SoC is said to deliver up to 15 percent better performance and up to 25 percent reduced power consumption compared to the N3 node. Unfortunately, MediaTek has not clarified if this difference is against the N3E (second-generation 3nm process) variant or the N3P (third-generation 3nm process) one. In related news, Qualcomm has announced its Snapdragon Summit 2025, which will be held from September 23, and we will likely witness the Snapdragon 8 Elite Gen 2 get a proper welcome, and it will take on the forthcoming Dimensity 9500.
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