The A18 Pro found in the newly announced MacBook Neo is slightly different from the silicon powering the iPhone 16 Pro and iPhone 16 Pro Max, as Apple has resorted to chip-binning, giving a 5-core GPU to the portable Mac, while its older-generation flagship smartphones are treated to a 6-core GPU. Fortunately, a new benchmark leak shows there’s practically no difference between the two SoCs.
The 6-core GPU belonging to the iPhone 16 Pro Max’s A18 Pro is only 5.6 percent faster compared to the 5-core GPU running in the MacBook Neo
The $599 portable Mac with the unique identifier Mac17,5 was spotted by MacRumors on Geekbench 6, with the scores showing little differences when compared to the iPhone 16 Pro Max. While it was assumed that the binned A18 Pro running in the MacBook Neo would suffer some kind of performance drop in the Metal benchmark, it turns out that the non-binned silicon is only 5.6 percent faster.
MacBook Neo
- Single-core score - 3,450
- Multi-core score - 8,702 (MacBook Neo is 2.7 percent faster)
- Metal score (GPU) - 31,286
iPhone 16 Pro Max
- Single-core score - 3,445
- Multi-core score - 8,476
- Metal score (GPU) - 33,030 (iPhone 16 Pro Max is 5.6 percent faster)
The MacBook Neo ends up obtaining the same results as the iPhone 16 Pro Max in Geekbench 6’s single-core test, but gains a negligible lead in the multi-core category. Of course, it is important to note that running Geekbench 6 on both devices doesn’t tell the entire picture, but it gives you an idea of what kind of performance to expect for the money.
The MacBook Neo is currently available for pre-order at retailers like Amazon, starting from $599 for 256GB storage and $699 for 512GB storage. Apple’s most affordable computer is expected to go on sale on March 11.
News Source: Geekbench 6
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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