Intel’s Sapphire Rapids HBM ‘Xeon Scalable’ CPUs With 64 GB HBM2e Memory Offer Up To 3x Performance Increase Over Ice Lake Xeons

Hassan Mujtaba
Intel Sapphire Rapids Xeon Platinum 8472C HBM CPU Is Up To 32% Faster Than Non-HBM 8480H 1

Intel has once again demonstrated its upcoming Sapphire Rapids HBM Xeon Scalable CPUs with up to 64 GB HBM2e memory in various workloads.

Intel Promises 3x Performance Boost With Its Next-Gen Sapphire Rapids HBM 'Xeon Scalable' CPU Lineup

According to Intel, the Sapphire Rapids-SP will come in two package variants, a standard, and an HBM configuration. The standard variant will feature a chiplet design composed of four XCC dies that will feature a die size of around 400mm2. This is the die size for a singular XCC die and there will be four in total on the top Sapphire Rapids-SP Xeon chip. Each die will be interconnected via EMIB which has a pitch size of 55u and a core pitch of 100u.

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The Intel Xeon processor code-named Sapphire Rapids with High Bandwidth Memory (HBM) is a great example of how we are leveraging advanced packaging technologies and silicon innovations to bring substantial performance, bandwidth, and power-saving improvements for HPC. With up to 64 gigabytes of high-bandwidth HBM2e memory in the package and accelerators integrated into the CPU, we’re able to unleash memory bandwidth-bound workloads while delivering significant performance improvements across key HPC use cases.

When comparing 3rd Gen Intel Xeon Scalable processors to the upcoming Sapphire Rapids HBM processors, we are seeing two- to three-times performance increases across weather research, energy, manufacturing, and physics workloads2. At the keynote, Ansys CTO Prith Banerjee also shows that Sapphire Rapids HBM delivers up to 2x performance increase on real-world workloads from Ansys Fluent and ParSeNet.

The standard Sapphire Rapids-SP Xeon chip will feature 10 EMIB interconnects and the entire package will measure at a mighty 4446mm2. Moving over to the HBM variant, we are getting an increased number of interconnects which sit at 14 and are needed to interconnect the HBM2E memory to the cores.

The four HBM2E memory packages will feature 8-Hi stacks so Intel is going for at least 16 GB of HBM2E memory per stack for a total of 64 GB across the Sapphire Rapids-SP package. Talking about the package, the HBM variant will measure at an insane 5700mm2 or 28% larger than the standard variant. Compared to the recently leaked EPYC Genoa numbers, the HBM2E package for Sapphire Rapids-SP would end up 5% larger while the standard package will be 22% smaller.

  • Intel Sapphire Rapids-SP Xeon (Standard Package) - 4446mm2
  • Intel Sapphire Rapids-SP Xeon (HBM2E Package) - 5700mm2
  • AMD EPYC Genoa (12 CCD Package) - 5428mm2

Intel also states that the EMIB link provides twice the bandwidth density improvement and 4 times better power efficiency compared to standard package designs. Interestingly, Intel calls the latest Xeon lineup Logically monolithic which means that they are referring to the interconnect that'll offer the same functionality as a single-die would but technically, there are four chiplets that will be interconnected together. You can read the full details regarding the standard 56 core & 112 thread Sapphire Rapids-SP Xeon CPUs here.

Intel Xeon CPU Families (Preliminary):

Family BrandingCoral RapidsDiamond RapidsClearwater ForestGranite RapidsSierra ForestEmerald RapidsSapphire RapidsIce Lake-SPCooper Lake-SPCascade Lake-SP/APSkylake-SP
Process NodeIntel 14A?Intel 18A-PIntel 18AIntel 3Intel 3Intel 7Intel 710nm+14nm++14nm++14nm+
Platform NameTBDIntel Oak StreamIntel Birch StreamIntel Birch StreamIntel Mountain Stream
Intel Birch Stream
Intel Eagle StreamIntel Eagle StreamIntel WhitleyIntel Cedar IslandIntel PurleyIntel Purley
Core ArchitectureTBDPanther Cove-XDarkmontRedwood CoveSierra GlenRaptor CoveGolden CoveSunny CoveCascade LakeCascade LakeSkylake
MCP (Multi-Chip Package) SKUsYesYesYesYesYesYesYesNoNoYesNo
SocketTBDLGA XXXX / 9324LGA 4710 / 7529LGA 4710 / 7529LGA 4710 / 7529LGA 4677LGA 4677LGA 4189LGA 4189LGA 3647LGA 3647
Max Core CountTBDUp To 192 P-CoresUp To 288Up To 128Up To 288Up To 64?Up To 56Up To 40Up To 28Up To 28Up To 28
Max Thread CountTBDUp To 192Up To 288Up To 256Up To 288Up To 128Up To 112Up To 80Up To 56Up To 56Up To 56
Max L3 CacheTBDTBDTBD480 MB L3108 MB L3320 MB L3105 MB L360 MB L338.5 MB L338.5 MB L338.5 MB L3
Memory SupportTBDUp To 16-Channel DDR5-9000+Up To 12-Channel DDR5-8000Up To 12-Channel DDR5-6400
MCR-8800
Up To 12-Channel DDR5-6400Up To 8-Channel DDR5-5600Up To 8-Channel DDR5-4800Up To 8-Channel DDR4-3200Up To 6-Channel DDR4-3200DDR4-2933 6-ChannelDDR4-2666 6-Channel
PCIe Gen SupportPCIe 6.0PCIe 6.0PCIe 5.0 (96 Lanes)PCIe 5.0 (136 Lanes)PCIe 5.0 (88Lanes)PCIe 5.0 (80 Lanes)PCIe 5.0 (80 lanes)PCIe 4.0 (64 Lanes)PCIe 3.0 (48 Lanes)PCIe 3.0 (48 Lanes)PCIe 3.0 (48 Lanes)
TDP Range (PL1)TBDTBDUp To 500WUp To 500WUp To 350WUp To 350WUp To 350W105-270W150W-250W165W-205W140W-205W
3D Xpoint Optane DIMMTBDTBDN/ADonahue PassN/ACrow PassCrow PassBarlow PassBarlow PassApache PassN/A
CompetitionTBDAMD EPYC VeniceAMD EPYC TurinAMD EPYC TurinAMD EPYC BergamoAMD EPYC Genoa ~5nmAMD EPYC Genoa ~5nmAMD EPYC Milan 7nm+AMD EPYC Rome 7nmAMD EPYC Rome 7nmAMD EPYC Naples 14nm
Launch2028-20292027202620242024202320222021202020182017
2022-06-01_18-47-22
2022-06-01_18-47-26
2022-05-31_16-57-45
2022-05-31_16-57-48
2022-05-31_16-58-02
2022-05-31_16-58-00

As for the footnotes for the Intel Sapphire Rapids HBM 'Xeon Scalable' CPU performance, you can see them below:

CloverLeaf

  • Test by Intel as of 04/26/2022. 1-node, 2x Intel® Xeon® Platinum 8360Y CPU, 72 cores, HT On, Turbo On, Total Memory 256GB (16x16GB DDR4 3200 MT/s ), SE5C6200.86B.0021.D40.2101090208, Ubuntu 20.04, Kernel 5.10, 0xd0002a0, ifort 2021.5, Intel MPI 2021.5.1, build knobs: -xCORE-AVX512 –qopt-zmm-usage=high
  • Test by Intel as of 04/19/22. 1-node, 2x Pre-production Intel® Xeon® Scalable Processor codenamed Sapphire Rapids Plus HBM, >40 cores, HT ON, Turbo ON, Total Memory 128 GB (HBM2e at 3200 MHz), BIOS Version EGSDCRB1.86B.0077.D11.2203281354, ucode revision=0x83000200, CentOS Stream 8, Linux version 5.16, ifort 2021.5, Intel MPI 2021.5.1, build knobs: -xCORE-AVX512 –qopt-zmm-usage=high

OpenFOAM

  • Test by Intel as of 01/26/2022. 1-node, 2x Intel® Xeon® Platinum 8380 CPU), 80 cores, HT On, Turbo On, Total Memory 256 GB (16x16GB 3200MT/s, Dual-Rank), BIOS Version SE5C6200.86B.0020.P23.2103261309, 0xd000270, Rocky Linux 8.5 , Linux version 4.18., OpenFOAM® v1912, Motorbike 28M @ 250 iterations; Build notes: Tools: Intel Parallel Studio 2020u4, Build knobs: -O3 -ip -xCORE-AVX512
  • Test by Intel as of 01/26/2022 1-node, 2x Pre-production Intel® Xeon® Scalable Processor codenamed Sapphire Rapids Plus HBM, >40 cores, HT Off, Turbo Off, Total Memory 128 GB (HBM2e at 3200 MHz), preproduction platform and BIOS, CentOS 8, Linux version 5.12, OpenFOAM® v1912, Motorbike 28M @ 250 iterations; Build notes: Tools: Intel Parallel Studio 2020u4, Build knobs: -O3 -ip -xCORE-AVX512

WRF

  • Test by Intel as of 05/03/2022. 1-node, 2x Intel® Xeon® 8380 CPU, 80 cores, HT On, Turbo On, Total Memory 256 GB (16x16GB 3200MT/s, Dual-Rank), BIOS Version SE5C6200.86B.0020.P23.2103261309, ucode revision=0xd000270, Rocky Linux 8.5, Linux version 4.18, WRF v4.2.2
  • Test by Intel as of 05/03/2022. 1-node, 2x Pre-production Intel® Xeon® Scalable Processor codenamed Sapphire Rapids Plus HBM, >40 cores, HT ON, Turbo ON, Total Memory 128 GB (HBM2e at 3200 MHz), BIOS Version EGSDCRB1.86B.0077.D11.2203281354, ucode revision=0x83000200, CentOS Stream 8, Linux version 5.16, WRF v4.2.2

YASK

  • Test by Intel as of 05/9/2022. 1-node, 2x Intel® Xeon® Platinum 8360Y CPU, 72 cores, HT On, Turbo On, Total Memory 256GB (16x16GB DDR4 3200 MT/s ), SE5C6200.86B.0021.D40.2101090208, Rocky linux 8.5, kernel 4.18.0, 0xd000270, Build knobs: make -j YK_CXX='mpiicpc -cxx=icpx' arch=avx2 stencil=iso3dfd radius=8,
  • Test by Intel as of 05/03/22. 1-node, 2x Pre-production Intel® Xeon® Scalable Processor codenamed Sapphire Rapids Plus HBM, >40 cores, HT ON, Turbo ON, Total Memory 128 GB (HBM2e at 3200 MHz), BIOS Version EGSDCRB1.86B.0077.D11.2203281354, ucode revision=0x83000200, CentOS Stream 8, Linux version 5.16, Build knobs: make -j YK_CXX='mpiicpc -cxx=icpx' arch=avx2 stencil=iso3dfd radius=8,

Ansys Fluent

  • Test by Intel as of 2/2022 1-node, 2x Intel ® Xeon ® Platinum 8380 CPU, 80 cores, HT On, Turbo On, Total Memory 256 GB (16x16GB 3200MT/s, Dual-Rank), BIOS Version SE5C6200.86B.0020.P23.2103261309, ucode revision=0xd000270, Rocky Linux 8.5 , Linux version 4.18, Ansys Fluent 2021 R2 Aircraft_wing_14m; Build notes: Commercial release using Intel 19.3 compiler and Intel MPI 2019u
  • Test by Intel as of 2/2022 1-node, 2x Pre-production Intel® Xeon® Scalable Processor code names Sapphire Rapids with HBM, >40 cores, HT Off, Turbo Off, Total Memory 128 GB (HBM2e at 3200 MHz), preproduction platform and BIOS, CentOS 8, Linux version 5.12, Ansys Fluent 2021 R2 Aircraft_wing_14m; Build notes: Commercial release using Intel 19.3 compiler and Intel MPI 2019u8

Ansys ParSeNet

  • Test by Intel as of 05/24/2022. 1-node, 2x Intel® Xeon® Platinum 8380 CPU, 80 cores, HT On, Turbo On, Total Memory 256GB (16x16GB DDR4 3200 MT/s [3200 MT/s]), SE5C6200.86B.0021.D40.2101090208, Ubuntu 20.04.1 LTS, 5.10, ParSeNet (SplineNet), PyTorch 1.11.0, Torch-CCL 1.2.0, IPEX 1.10.0, MKL (2021.4-Product Build 20210904), oneDNN (v2.5.0)
  • Test by Intel as of 04/18/2022. 1-node, 2x Pre-production Intel® Xeon® Scalable Processor codenamed Sapphire Rapids Plus HBM, 112 cores, HT On, Turbo On, Total Memory 128GB (HBM2e 3200 MT/s), EGSDCRB1.86B.0077.D11.2203281354, CentOS Stream 8, 5.16, ParSeNet (SplineNet), PyTorch 1.11.0, Torch-CCL 1.2.0, IPEX 1.10.0, MKL (2021.4-Product Build 20210904), oneDNN (v2.5.0)
Hassan Mujtaba Photo

About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.

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