Intel Panther Lake-H & Panther Lake-U CPU Configurations Revealed: Up To 16 CPU Cores, 12 Xe3 “Celestial” iGPU Cores, Five Tiles In 25W Flavors

Jul 16, 2024 at 02:55am EDT
Intel's Next-Gen Panther Lake Configurations Revealed: Up To 16 CPU & 12 Xe3 "Celestial" GPU Cores 1

Intel's next-gen Panther Lake CPU configurations have been revealed along with the first blueprint revealing up to 5 tiles.

Intel Panther Lake CPUs Will Feature Five Tiles But Only 3 Will Be Active: Up To 16 CPU Cores, 12 Xe3 "Celestial" iGPU Cores & 25W TDPs

Intel's Panther Lake CPUs are going to be a big deal for the blue team and will be a major launch for 2025. The company has confirmed that it has achieved "Power On" with these next-gen chips and will be entering production on the 18A process node in the first half of 2025 and availability is planned for the second half of 2025.

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Now we have new information covering the Intel Panther Lake CPU configurations from @Jaykihn. The leak covers a Panther Lake-H CPU blueprint along with details of three configurations. The Intel Panther Lake CPUs will cover a wide range of laptop platforms, from thin and light to high-end. The high-end family will be codenamed Panther Lake-H while the entry-level family will be codenamed Panther Lake-U. These will replace the Arrow Lake-H and Arrow Lake-U CPUs which aim a launch in early 2025.

Starting first with the Intel Panther Lake-H family, the CPUs will come in two configurations, one with 4 P-Cores based on the Cougar Cove architecture, 8 E-Cores based on the Darkmont architecture, and 4 additional LP-E cores. We can't confirm if these will utilize the same Darkmont cores on the Skymont E-Core architecture which debuts on Lunar Lake and Arrow Lake CPUs.

The difference between the two configurations will be the iGPU architecture which will include 12 Xe3 cores on the top die and 4 Xe3 cores on the second die. The iGPU will be utilizing the Celestial "Xe3" graphics architecture. The Panther Lake-H CPUs will have a PL1 TDP of 25W and a PL2 rating of 45W.

For the entry-level "Thin & Light" segment, we are looking at the Intel Panther Lake-U series which will feature 4 P-Cores and 4 LP-E cores for a total of 8 cores. The iGPU will house 4 Xe3 cores. The TDP for this chip is expected to be 15W (PL1) and probably a 28-30W (PL2) power rating.

Intel Panther Lake CPU Configurations

Die SKUP-Cores (Cougar Cove)E-Cores (Darkmont)LP-E Cores (Skymont?)Xe3 GPU Cores (Celestial)PL1 TDPPL2 TDP
Panther Lake-H4841225W45W
Panther Lake-H484425W45W
Panther Lake-H480425W45W
Panther Lake-U404415W45W
Panther Lake-U204415W45W
Image Source: @Jaykihn

In addition to the Panther Lake CPU configurations, we also get a look at the blueprint of the Intel Panther Lake-H CPU. It is stated that the CPU will feature a total of five tiles but only three will be active. The "Die 4" is the compute tile, the "Die 1" is the Platform Controller Die (PCD), and the "Die 5" is the Graphics (Xe3) tile. That leaves Die 2 and Die 3 which are passive and are placed there to achieve a rectangular shape for the chip. Lunar Lake also features a filler tile for similar reasons. The blueprint also gives us an approximate die size of each tile which is listed below:

Based on the calculations above, we can expect the Intel Panther Lake CPUs to be a tad bit larger compared to Meteor Lake CPUs but do remember that this is the H-SKU and not the U-SKU which should be smaller.

During its Tech Tour in Taipei, we learned that Intel's Panther Lake is going to be more flexible than Lunar Lake, going into various segments and offering even higher memory capacities on thin and light platforms (on-package). With the company's Innovation event due for September, we can expect some more bits and pieces to be cleared up regarding Panther Lake soon.

About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.

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