G.Skill Announces the Trident X Series DDR3-2400 MHz Overclocking Memory featuring Modular Heatsink
G.Skill has unveiled its latest Trident X Series Overclocking Memory which are built specifically and optimized for the Ivy Bridge (7-Series Chipset) Platform. The memory modules come with 2400MHz DDR3 configurations and a modular heatsink overclocking design.
The memory modules would feature a Red and Black color theme and would be equipped with a black heatsink, there’s an additional detachable heatspreader which goes on top of the module featuring its own heatpipe cooling design. The detachable heatsink would come in handy for users with large air coolers.
The memory modules support the Intel XMP 1.3 mode, the ones pictured are DDR3-2400 MHz (PC3-19200) modules running in Dual Channel configuration running with timings of10-12-12-31T, and DRAM voltage of 1.65V.
There would be other memory kits available ranging from 4GB/8GB/16GB and also 16GB/32GB kits for Sandy Bridge-E platform. The Trident X Series launches on 4th May 2012.