Samsung’s fourth member of the Galaxy S25 family is said to have the thinnest design, but the latest Galaxy S25 Slim renders show that there are still some similarities between them. Here, we get a closer look at perhaps one of the most embellished high-end smartphones that will materialize in the coming weeks.
New renders show that the Galaxy S25 Slim will have slimmer bezels, and with the camera bump included, it will be slightly thicker than the Galaxy S25 Ultra
Thanks to a previous leak, we learned that the Galaxy S25 Slim will be powered by the overclocked version of the Snapdragon 8 Elite, along with 12GB RAM, making it for quite a powerful configuration, though we have to mention that the chipset’s multi-core performance was below satisfactory. This is likely due to the fact that the Galaxy S25 Slim will flaunt an exceptionally thin exterior, as revealed by Smartprix and @OnLeaks, who have collaborated to deliver the first detailed render gallery of Samsung’s fourth flagship.
Like the remaining three models, the Galaxy S25 Slim will feature rounded corners, coupled with extremely thin bezels, along with a triple-camera array at the rear and a front-facing shooter. The display size will be between 6.7 to 6.8 inches. As for the dimensions, we have learned that the sleek flagship will measure around 159mm x 76mm x 6.4mm, making it one of the slimmest devices around. In fact, what is most impressive is that with the camera bump included, the Galaxy S25 Slim will measure 8.3mm, while the Galaxy S25 Ultra without the bump is said to be 8.2mm thick.
If we do the math, the Galaxy S25 Slim will be 1.6mm narrower, 3.8mm shorter, and 1.8mm thinner than Samsung’s top-end model. As for the launch, it is believed that this particular version will not be unveiled alongside the trio on January 22 but is expected to be announced sometime in May. We will share more updates on this development, but for now, let us know what you think about these renders.
News Source: Smartprix
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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