55%
Plausible
Samsung has proven that it can develop cutting-edge lithography, with its upcoming Exynos 2700 serving as an excellent example, as the company has been reported to be progressing well with its next flagship SoC. However, as far as its 2nm GAA process goes, a rumor states that when comparing Power, Performance, and Area (PPA) metrics, TSMC’s 2nm N2P is ahead in the race. This may explain why, alongside improving its 2nm process, Samsung is also developing innovative heat dissipation solutions for its top-end chipsets, as it’s a means towards holding its own against the competition.
Exynos 2700 to be aided by Samsung’s new Side-By-Side and Heat Pass Block cooling solutions to allow for better sustained performance while also masking the potential 2nm node’s inefficiency
One of the first innovations, Heat Pass Block (HPB), was implemented in the Exynos 2600, with tests showing that the latter delivers better results than a Snapdragon 8 Elite Gen 5 cooled by liquid nitrogen, which is impressive stuff. The next solution, Samsung’s Side-By-Side (SBS) architecture, is said to debut with the Exynos 2700, providing yet another way for the SoC to maintain its thermals. However, why is the company going through such lengths to ensure that its chipsets offer better sustained performance?
The answer may lie in Weibo’s Smart Chip Insider post, who mentions that Samsung’s 2nm GAA node is lagging behind TSMC’s 2nm N2P, leaving the manufacturer with little choice but to implement newer technologies to gain an edge over the upcoming Snapdragon 8 Elite Gen 6 Pro and Dimensity 9600. Unfortunately, even with these implementations, Smart Chip Insider isn’t too confident in the Exynos 2700’s ability to beat or match its future rivals, but it should be mentioned that Samsung has covered immense ground with its Exynos 2600.
Also, if Samsung’s innovative solutions weren’t effective in maintaining the temperatures of these high-end SoCs, then Qualcomm wouldn’t have used it in its Snapdragon 8 Elite Gen 6 Pro, at least that’s what a previous leak suggests. We will agree that the Korean giant has ample room to improve its 2nm technology, as the Exynos 2600 can peak at 30W when under load, which is typically the load of various laptop processors powering significantly larger machines. Assuming this is how the Exynos 2700 will operate as well, the need for Samsung’s newest cooling implementations becomes imperative.
News Source: Smart Chip Insider
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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